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High Density Interconnect PCB 10Layer 2 Step HDI Board| YMS PCB

Short Description:

HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials.

Parameters

Layers: 10

Base Material:FR4 High Tg S1170

Thickness:1.78±0.15mm

Min Holes:0.2mm

Minimum Line Width/Clearance:0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH and Line: 0.2mm

Size:235mm×118mm

Aspect Ratio:8 : 1

Surface treatment:ENIG

Differential impedance 100+7/-8Ω

Speciality: Laser via copper plated shut,VIPPO Technology

Applications:Communication

 


Product Detail

Product Tags

What is HDI PCB

HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It’s relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

HDI PCB 2+n+2

Advantages of HDI PCB

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB manufacturing capabilities overview
Feature capabilities
Layer Count 4-60L
Available HDI PCB Technology 1+N+1
2+N+2
3+N+3
4+N+4
5+N+5
Any layer
Thickness 0.3mm-6mm
Minimum line Width and Space 0.05mm/0.05mm(2mil/2mil)
BGA PITCH 0.35mm
Min laser Drilled Size 0.075mm(3nil)
Min mechanical Drilled Size 0.15mm(6mil)
Aspect Ratio for laser hole 0.9:1
Aspect Ratio for through hole 16:1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
Copper filled, silver filled
Laser via copper plated shut
Registration ±4mil
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

 

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