IC Ragewa
IC substrates suna aiki azaman haɗi tsakanin guntun (s) na ICB da PCB ta hanyar hanyar sadarwa mai raɗaɗi da ramuka. IC substrates suna tallafawa ayyuka masu mahimmanci gami da goyan bayan kewaye da kariya, ɓarkewar zafi, da sigina da rarraba ƙarfi.
IC substrates suna wakiltar matakin mafi girma na ƙaramin abu a cikin masana'antar PCB kuma suna da kamanceceniya da yawa tare da masana'antar semiconductor.
IC substrate yana tasowa tare da haɓaka sabbin nau'ikan ICs kamar BGA (ƙwallon grid array) da CSP (ƙarar sikelin sikeli) waɗanda ke kira ga sabbin dako na kunshin. Kamar yadda wani nau'i na PCB mai matukar cigaba (Buga Circuit Board), IC substrate PCB ya fashe cikin shahararriya da aikace-aikace tare da kowane layin HDI PCB da PCB mai sassauci, wanda yanzu ake amfani dashi sosai a cikin hanyoyin sadarwa da sabunta lantarki.