Magawo a IC amatumizira monga kulumikizana kwa ma chip (ma) IC ndi PCB kudzera pamaneti ndi mabowo. Magawo a IC amathandizira ntchito zofunikira kuphatikiza kuthandizira dera ndi chitetezo, kutaya kwanyengo, ndi sigito ndi kugawa kwamagetsi.
Magawo a IC amayimira mulingo wapamwamba kwambiri wama miniaturization pakupanga kwa PCB ndipo amagawana zofananira zambiri ndi kupanga kwa semiconductor.
Gawo la IC lakhala likukula ndikukula kwa mitundu yatsopano ya ma IC monga BGA (gulu la grid) ndi CSP (chip scale package) yomwe imafuna ofuna kunyamula phukusi latsopano. Monga mtundu umodzi wa PCB yotsogola kwambiri (Printed Circuit Board), IC gawo lapansi la PCB laphulika potchuka komanso kugwiritsa ntchito limodzi ndi gulu lililonse la HDI PCB ndi Flex-rigid PCB, yomwe tsopano imagwiritsidwa ntchito pazamafoni ndi zosintha zamagetsi.