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Original Factory 50u Hard Gold Plated Computer Laptop Printed Circuit Board

Short Description:

Parameters

Layers: 10

Base Material:S1170

Thickness:1.6

Minimum Line Width/Clearance:0.10mm/0.10mm

Size:100mm×100mm

Aspect Ratio:16 : 1

Surface treatment:ENIG

Crafts

Immersion Gold:4“

2 Step HDI

Resin Plug Hole Technology

High Frequency Board

Applications:Communication


Product Detail

Product Tags

Our business sticks for the basic principle of “Quality could be the life with the firm, and track record will be the soul of it” for Original Factory 50u Hard Gold Plated Computer Laptop Printed Circuit Board, We give priority to high quality and customer fulfillment and for this we follow stringent good quality control measures. We have now in-house testing facilities where our goods are tested on every single aspect at different processing stages. Owning to latest technologies, we facilitate our shoppers with custom made manufacturing facility.
Our business sticks for the basic principle of “Quality could be the life with the firm, and track record will be the soul of it” for Pcb Board, Pcb Circuit Board, Printed Circuit Board, Only for accomplishing the good-quality product to meet customer’s demand, all of our products have been strictly inspected before shipment. We always think about the question on the side of the customers, because you win, we win!
HDI basic production process:

A、Brown multilayer circuit board to form Browning film on the surface of copper foil layer, and laser drilling on the surface of copper foil to form laser blind hole

B、 drill the multi-layer circuit board to form a mechanical drill hole

C、 The multi-layer circuit board is coated with copper to form a copper layer in the laser blind hole mechanical drilling, and then the multi-layer circuit board is electroplated to thicken the copper layer in the hole

D、The above multilayer circuit board is made of outer graphics, and the surface treatment of etched screen print resistance welding on the outer layer of graphics electroplating is carried out to obtain the finished HDI board


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