Likarolo tsa IC li sebetsa joalo ka khokahano lipakeng tsa li-chip kapa li-IC ka marang-rang a tsamaisang marang-rang le masoba. Likarolo tsa IC li tšehetsa mesebetsi ea bohlokoahali ho kenyelletsa ts'ehetso le ts'ireletso ea potoloho, ho chesa mocheso le phepelo ea motlakase le phepelo ea motlakase.
Likarolo tsa IC li emela boemo bo phahameng ka ho fetisisa ba miniaturization tlhahiso ea PCB mme e arolelana lintho tse ngata tse tšoanang le tlhahiso ea semiconductor.
IC substrate e ntse e tsoela pele ka kholo ea mefuta e mecha ea li-IC joalo ka BGA (ball grid array) le CSP (chip scale package) e batlang bajari ba bacha ba liphutheloana. E le mofuta o mong oa PCB e tsoetseng pele ka ho fetesisa (Printed Circuit Board), IC substrate PCB e phatlohile ka botumo le lits'ebetso hammoho le lera le leng le le leng la HDI PCB le Flex-rigid PCB, e seng e sebelisoa haholo ho likhokahanyo tsa mehala ea puisano le tsa elektroniki.