Imigca emincinci ye-IC isebenza njengonxibelelwano phakathi kwe-IC chip (s) kunye ne-PCB ngothungelwano oluqhubayo lomkhondo kunye nemingxunya. Iziqwengana ze-IC zixhasa imisebenzi ebalulekileyo kubandakanya inkxaso yesekethe kunye nokukhuselwa, ukusasazeka kobushushu, kunye nomqondiso kunye nokusasazwa kwamandla.
Imigca emincinci ye-IC imele inqanaba eliphezulu le-miniaturization kwimveliso ye-PCB kwaye yabelana ngokufana okuninzi kunye nokuveliswa kwe-semiconductor.
I-IC substrate iye yaphuhliswa kukuduma kweentlobo ezintsha ze-ICs njenge-BGA (uluhlu lwebhola yegridi) kunye ne-CSP (iphakheji yesikali se-chip) ebiza abathwali abatsha bepakethe. Njengolunye uhlobo lwePCB ehambele phambili (iBhodi yeSekethe eprintiweyo), i-IC substrate PCB iye yaqhuma kukuduma kunye nokusetyenziswa kunye nayo nayiphi na i-PCB ye-HDI ye-PCB kunye ne-PCB eqinile, ngoku isetyenziswa ngokubanzi kunxibelelwano kunye nohlaziyo lwe-elektroniki.