Izingxenye ze-IC zisebenza njengokuxhumana phakathi kwama-IC chip (s) ne-PCB ngokusebenzisa inethiwekhi eqhubayo yokulandela umkhondo nezimbobo. Izingxenye ze-IC zisekela imisebenzi ebucayi kubandakanya ukwesekwa nokuvikelwa kwesekethe, ukushabalalisa ukushisa, kanye nokwabiwa kwesiginali namandla.
Izingxenye ze-IC zimelela izinga eliphakeme kakhulu le-miniaturization ekukhiqizeni i-PCB futhi lihlanganyela ngokufana okuningi ngokukhiqizwa kwe-semiconductor.
I-substrate ye-IC ibilokhu ithuthuka ngokuchuma kwezinhlobo ezintsha zama-IC afana ne-BGA (i-ball grid array) ne-CSP (chip scale package) ebiza abathwali abasha bephakeji. Njengolunye uhlobo lwe-PCB esithuthuke kakhulu (Iphrintiwe Yesekethe IBhodi), IC substrate PCB iqhume ekuthandeni nasekusebenziseni kanye nanoma iyiphi ungqimba lwe-HDI PCB kanye ne-PCB eqinile, manje esetshenziswa kabanzi kwezokuxhumana nakwizibuyekezo ze-elekthronikhi.