Makemake ʻoe e ʻike i ka hōʻuluʻulu hoʻākāka o ka PCB alumini substrate? A laila Yongmingsheng ʻoihana alumini mea hana substrate e haʻi iā ʻoe.

ʻO ka pāpale kumu aluminika kahi ʻano o ka papa kila keleawe paʻa pā keleawe me ka hana dissipation heat maikaʻi E hoʻomaopopo i ka hoʻohālikelike ʻana o ka papa kumu alumini PCB.

1.flexible ʻāpana substrate

ʻO kekahi o nā mea hou i kūkulu ʻia i loko o nā mea IMS he dielectric hikiwawe. Hāʻawi kēia mau mea i ka uila uila maikaʻi, maʻalahi a me ka halihali wela. Ke hoʻopili ʻia i nā mea alumini maʻalahi, hiki ke hana i nā huahana e hoʻokō i nā ʻano like ʻole a me nā kihi, i hiki ke hoʻopau i nā lako pipiʻi, uwea a me nā mea hoʻopili.

2. mea hoʻohui aluminika alumini substrate

ʻO nā mea maʻamau he 2-ʻāpana a i ʻole he 4-ʻāpana subassemblies i hana ʻia mai FR-4 maʻamau, i hoʻopili ʻia i kahi substrate alumini me kahi dielectric thermoelectric e kōkua i ka hoʻopau wela, hoʻonui i ka rigidity a hana ma ke ʻano he pale.

3.multi-layer alumini substrate

I ka mākeke lako mana hana kiʻekiʻe, hana ʻia ʻo IMSPCB nunui-papa i nā dielectric conductive multi-layer. ʻO kēia mau hale i hoʻokahi a ʻoi mau papa o nā kaapuni i hoʻokomo ʻia i ka dielectric, me nā puka makapō i hoʻohana ʻia e like me nā puka wela a i nā ala hōʻailona.

4.through hole alumini substrate

I loko o nā hanana paʻakikī loa, hiki i kahi papa o ke alumini ke hana i kahi "kumu" o nā papa he nui o ka hoʻolālā wela. Hoʻomoe mua ʻia ka Aluminium a hoʻopiha ʻia me ka dielectric ma mua o ka lamination. Hiki ke lamineka ʻia kahi mea wela a i ʻole subass Assembly i nā ʻaoʻao ʻelua o ka alumini e hoʻohana ana. kahi laminated wela, i ka manawa i lamineka ʻia, ua like ka mea i hoʻopau ʻia me kahi substrate alumini multilayer kuʻuna e nā lua ʻeli. ʻO ka uila ma o nā puka e hele i nā āpau i loko o ka aluminika e mālama ai i ka hoʻopili uila.

Ma luna ka hoʻonohonoho a me ka hōʻuluʻulu o ka substrate alumini PCB, lana koʻu manaʻo e kōkua iā ʻoe, he mea hana ʻoihana PCB alumini mea hana mai Kina, ʻoluʻolu e nīnau