As its name implies, the thermal conductivity of aluminum base board is a kind of aluminum base board heat dissipation performance parameter, it is one of the three standards to measure the quality of aluminum base board (thermal resistance value and pressure resistance value are the other two properties).
Aluminum base board thermal conductivity can be tested after plate bonding instrument tests data, the high value of thermal conductivity is generally ceramic, copper, etc., but because of the cost of the given problem, most currently on the market for aluminum base board, aluminum base board thermal conductivity of the corresponding is parameters of people’s concern, the higher the coefficient of thermal conductivity is one of the symbols of the better performance.
Aluminum base board is a unique metal substrate copper clad aluminum base board, which has good thermal conductivity, electrical insulation and mechanical properties.
There are three types of aluminum base board:
The first one is universal aluminum clad copper plate, the insulation layer is made of epoxy glass cloth bonding sheet;
Second, high heat dissipation aluminum clad copper plate, insulation layer by high thermal conductivity of epoxy resin or other resin composition;
Third, aluminum-based copper clad plate is used for high-frequency circuit, and the insulation layer is composed of polyolefin resin or polyimide resin glass cloth bonding sheet.
The major difference between aluminum clad copper plate and conventional fr-4 clad copper plate lies in its heat dissipation. Compared with aluminum clad copper plate with a thickness of 1.5mm, the thermal resistance of the former is 20~22, and that of the latter is 1.0~2.0, while that of the latter is much smaller.
Technical requirements for aluminum base board
Up to now, there is no international standard of aluminum-base copper clad plate.
The main technical requirements are: size requirements is including panel size and deviation, thickness and deviation, verticality and warping degree; appearance is including cracks, scratches, burrs and layering, aluminum oxide film requirements; performance is including peel strength, surface resistivity, small breakdown voltage, dielectric constant, combustion and thermal resistance requirements.
Special test method for aluminum – based copper clad plate
1. The measurement method of dielectric constant and dielectric loss factor is series resonance method with variable Q value. The principle of connecting the sample and the tuning capacitor in series to the high-frequency circuit to measure the Q value of the series circuit;
2、The heat resistance measurement method is calculated by the ratio of temperature difference between different temperature measuring points and thermal conductivity.
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Post time: Sep-03-2019