The classification and characteristics of LED aluminum substrate pcb circuit preparation, the following by our manufacturers for your analysis.
LED aluminum pcbs substrate circuit preparation classification
LED aluminum substrate is mainly used as the medium of heat energy export between LED grains and system circuit board, mainly by the production process of playing line, eutectic or cladding and LED grains.Considering the heat dissipation, the market LED aluminum substrate is mainly composed of ceramic substrate, which can be divided into three types: thick film ceramic substrate, low temperature co-fired multilayer ceramic substrate and thin film ceramic substrate according to the circuit preparation.
The characteristics of LED aluminum pcbs substrate circuit preparation
In the traditional high power LED components, thick film or low temperature co-fired ceramic substrate is used as the grain heat dissipation substrate, and then the LED grains are combined with the ceramic substrate in the way of gold wire.As described in the preface, the gold wire connection limits the efficiency of heat loss along the electrode junction.Therefore, domestic and foreign big factories are all working hard to solve this problem.
The solution has two, one is to look for the substrate material of high coefficient of heat transfer, to replace the alumina, contains a silicon substrate, silicon carbide substrate, anodized aluminum plate or aluminum nitride substrates, including semiconductor silicon and silicon carbide substrate material properties, make its meet more stringent tests at present stage, and anodized aluminum plate is easily due to lack of the anodized oxidation layer strength caused by fracture conductivity, make its limited in practical application, therefore, at this stage is relatively mature and common acceptance of higher is the aluminum nitride as the heat dissipation base board.
However, due to the limitation that the aluminum nitride substrate is not suitable for the traditional thick film manufacturing process (the material must undergo atmospheric heat treatment at 850℃ after the printing of silver glue, which causes the material reliability problem), therefore, the aluminum nitride substrate circuit needs to be prepared by the thin film process.The aluminum nitride substrate prepared by the thin film process greatly accelerates the efficiency of heat transfer from LED grains through the substrate material to the system circuit board, thus greatly reducing the burden of heat transfer from LED grains through the metal wire to the system circuit board, thus achieving the effect of high thermal dispersion.
The above is the classification and characteristics of LED aluminum pcbs substrate circuit preparation. We are a professional LED aluminum substrate circuit supplier YMS. This article hopes to be helpful to you!
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Post time: Jan-06-2021