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Itekhnoloji yonyango yomphezulu we-aluminium substrate | YMS

Njani ngetekhnoloji kwi-aluminium substrate aluminium pcb umphezulu ukwenza amabinzana athile.

Emva kokuba izinto zombane zifakiwe kwibhodi yesekethe eprintiweyo, kufuneka ithengiswe ngokuzenzekelayo.Ukuba ezi nkqubo, ukuba kukho izinto amagwebu, ukongeza eprintiweyo ibhodi yesekethe processing iteknoloji akukho ngqiqweni, kodwa kwakhona ezinxulumene ukuntywiliselwa welding ukumelana Ukunganyangeki kakuhle kwe-aluminium substrate ekhokelela ekunciphiseni ukuzinza komgangatho weenkqubo, kunye nokonakalisa icandelo lonke ngokubi.

I-Aluminium substrate yinto edibeneyo ye-resin, i-aluminium kunye ne-copper foil.I-Resin kunye ne-aluminium, i-coil coefficient yokwandiswa kwe-thermal iyahluke kakhulu, ngoko ke, kumandla angaphandle, phantsi kobushushu, ukuvelisa ukuhanjiswa okungalinganiyo kwamandla angaphakathi kwiplate. Ukuba iimolekyuli zamanzi kunye nezinye izinto ezisezantsi zemolekyuli zihlala kumngxunya wokunxibelelana kweplate, uxinzelelo oluxineneyo luya kuba lukhulu phantsi kwemeko yokothuka kobushushu.

Ukuba isincamathelisi siyasilela ukumelana nale mikhosi yonakalisayo yangaphakathi, i-lamination kunye ne-foam iya kwenzeka phakathi kwefoyile yobhedu kunye ne-substrate, okanye phakathi kwe-substrate layers, kwindawo ebuthathaka. Ukuphucula ukumelana ne-solder ye-aluminium substrate, kubalulekile ukunciphisa Iindlela zokuphucula ikakhulu zibandakanya umphezulu wonyango wefoyile yobhedu kunye nealuminium, ukuphuculwa kwento yokuncamathelisa intlaka, kunye nolawulo loxinzelelo kunye nobushushu kwinkqubo ngokucofa.

Amandla okudibanisa e-aluminium ujongano ngokubanzi luchazwa ngamacandelo amabini:

Okokuqala, isiseko sealuminium kunye nokuncamatheliswa kwesiseko seplastikhi yentsimbi (ubushushu bokuncamathelisa i-resin ephambili okanye yokuncamathelisa)

Okwesibini, ngamandla okuncamathelisa phakathi kokuncamathelisa nentlaka.

Ukuba iglu inokungena kubume be-aluminium kakuhle, kwaye ukulungiswa kwe-aluminium substrate kunokudityaniswa ngokunxibelelene ne-resin ephambili, amandla aphezulu e-peel e-aluminium substrate anokuqinisekiswa.

Iindlela zokunyanga umphezulu weAluminiyam zii-oxidation, ukuzoba ngocingo, njl njl, kungokwandiswa kobuso bomhlaba ukuphucula ukunamathela.

Oku kungasentla yi-aluminium substrate i-aluminium yonyango yonyango lobuchwephesha. Ndiyathemba ukuba eli nqaku liza kuba luncedo kuwe.

Ulwazi lomfanekiso i-aluminium pcb


Ixesha Post: Jan-14-2021
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