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PCB factory tells you the difference between immersion gold and gold plating

Immersion gold board and gold plating board are commonly used in the production of printed circuit board.

With the integration of IC higher and higher, IC feet are also more and more dense. However, the vertical tin spraying process is difficult to smooth the fine solder pad, which brings difficulty to SMT sticking. In addition, the shelf life of tin spraying board is very short. And the gold plating board is good to solve these problems. For surface mount process, especially for ultra-small surface mount, the flatness of solder pad is directly related to the quality of solder paste printing process, and has a decisive impact on the quality of reflow welding, so, the gold plating board in high density and ultra-small surface mount process often seen. In the trial production stage, affected by factors such as the purchase of components is often not the board to be immediately welded, but often to wait for a few weeks or even months to use, the shelf life of the board gilt board is many times longer than the tin board. Therefore, we are willing to adopt. Besides, the cost of gold plating board in sample stage is almost the same as that of lead-tin alloy plate.


gold plating boards

What is gold plating

Gold plating refers to electric gold plating, electroplated nickel gold plate, electrolytic gold plate, electric gold plate, electronickel gold plate, soft gold and hard gold (commonly used as goldfinger) distinction. Its principle is nickel and gold (commonly known as gold salt) dissolved in chemical liquid solution, the circuit board immersed in the electroplating cylinder and current on the copper foil surface of the circuit board to generate nickel gold coating, electronickel gold because of its coating hardness, wear resistance, not easy to oxidation characteristics in electronic products have been widely used.

What is immersion gold

Immersion gold is a chemical REDOX reaction to generate a layer of coating, generally thicker thickness, is a chemical nickel gold deposit method, can reach a thicker layer of gold, usually called immersion gold.


hdi printed circuit board

The difference between immersion gold board and gold plating board

First, the immersion gold and gold plating board formed by the crystal structure is not the same, immersion gold for gold thickness is much thicker than gold plating, the colour of immersion gold is more yellow, and more satisfied with the customer.

Second, immersion gold is easier to weld than gold plating, will not cause poor welding and customer complaints. At the same time immersion gold is softer than gold plating, so gold finger board generally choose gold plating, hard gold wear – resistant.

Third, the immersion gold board only has nickel gold on the solder pad, skin effect signal transmission is in the copper layer will not affect the signal.

Fourth, the immersion gold is more dense than the gold-plated crystal structure, not easy to produce oxidation.

Fifth, with the wiring more and more dense, line width, spacing has reached 3-4mil. Gold plating is easy to produce short circuit of gold wire. There is only nickel gold on the solder pad of the immersion gold board, so there is no short circuit of gold wire

Sixth, the immersion gold board only has the nickel gold on the solder pad, so the resistance welding on the circuit and the copper layer com ination is stronger. The compensation will not affect the spacing

Seven, generally used for the relatively higher requirements of the board, flatness is better, generally use immersion gold board, immersion gold will not appear after the assembly of the black pad phenomenon. The flatness of immersion gold board is as good as the shelf life of gold plating board.


single layer pcb manufacturer

Huizhou Yongmingsheng Technology co., ltd. were successively established. Our enterprise is a high-tech enterprise which professional manufacture and sale high-precision single, double, multi-layer PCB, FPC, metal pcb,Flex-Rigid Board and aluminum base board.

Post time: Nov-26-2019
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