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Thick Copper PCB 10 Layer (4OZ) High Tg Full Body Hard Gold (BGA) Board| YMS PCB

Thick Copper PCB 10 Layer (4OZ) High Tg Full Body Hard Gold (BGA) Board| YMS PCB Featured Image
  • Thick Copper PCB 10 Layer (4OZ) High Tg Full Body Hard Gold (BGA) Board| YMS PCB
  • Thick Copper PCB 10 Layer (4OZ) High Tg Full Body Hard Gold (BGA) Board| YMS PCB

Short Description:

Heavy copper PCB is also known as thick copper PCB, in which there are 3 ounces (oz) of copper or more on the internal and external layers of a printed circuit board.

Parameters

Layers: 10L 4OZ Heavy copper PCB

Base Material:S1170

Thickness:2.5mm

Min. Hole：0.25mm

Minimum Line Width/Clearance：0.25mm/0.25mm

Minimum Clearance between Inner Layer PTH and Line： 0.2mm

Size：107.61mm×107.6mm

Aspect Ratio：10 : 1

Surface treatment：Hard Gold plating

surface copper ≧4OZ

Speciality:  Full Body hard gold plating , finished Copper Thickness: 4 OZ

Applications:power electronic devices


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What is Heavy copper PCB?

Heavy copper PCB products are widely used in power electronic equipment and power supply system.The additional copper PCB thickness enables the board to conduct a higher current, achieve good thermal distribution and implement complex switches in a limited space.

This unique type of thick copper PCB has a finished copper weight of more than 4 ounces (140 microns), compared to the standard PCB copper thickness of 1ozor 2oz.

8OZ-Heavy-Copper-PCB

YMS Heavy copper PCB manufacturing capabilities:

YMS Heavy copper PCB manufacturing capabilities overview
Feature capabilities
Layer Count 1-30L
Base Material FR-4 Standard Tg,  FR4-mid Tg，FR4-High Tg
Thickness 0.6 mm – 8.0mm
Maximum Outer Layer Copper  Weight (Finished) 15OZ
Maximum Inner Layer Copper  Weight (Finished) 30OZ
Minimum line Width and Space 4oz Cu 8mil/8mil; 5oz Cu 10mil/10mil; 6oz Cu 12mil/12mil; 12oz Cu 18mil/28mil; 15oz Cu 30mil/38mil .etc.
BGA  PITCH 0.8mm(32mil)
Min mechanical Drilled Size 0.25mm(10mil)
Aspect Ratio for through hole 16：1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
Copper filled, silver filled
Registration ±4mil
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

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