4 Layer (4/4/4/4OZ) Heavy Copper Black Soldermask Board | YMS PCB
Thick copper plate basic production process:
A、The inner core plate is obtained by cutting materials, and the inner circuit is made on each inner core plate respectively through the processing of inner graph and etching. A number of copper pads are interleaved on the edge of the plate in the open area of each inner core plate to make each inner core plate.
B、The inner layer and outer layer of copper foil are pressed together by semi-curing sheet to make multi-layer production plate.
C、According to the existing technology, the thick copper plate is prepared by the post-treatment of the multilayer production plate.
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