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Selective Hard Gold PCB High TG FR4 Material main board| YMS PCB

Short Description:

Glass Transition Temperature (Tg)—This is an important parameter for the base material, as it determines the temperature at which the resin matrix changes over from a firm, non-elastic condition to a soft, elastic one.

Parameters

Layers: 8L High Tg FR4 Material

Base Material:IT180A High tg 170°

Thickness:3.2mm

Min Holes:0.25mm

Minimum Line Width/Clearance:0.10mm/0.10mm

Minimum Clearance between Inner Layer PTH to Line: 0.2mm

Size:192mm×135mm

Aspect Ratio:12.8 : 1

Surface treatment:ENIG+Selective Hard Gold Plating

Process characteristics: High tg,  Selective hard gold

Applications:Communication


Product Detail

Product Tags

What is high Tg PCB (printed circuit board)

Normally high Tg refers to high heat resistance in PCB raw material, the standard Tg for copper clad laminate is between 130 – 140℃, High Tg is generally greater than 170℃, and middle Tg is generally greater than 150℃. Basically the printed circuit board with Tg≥170℃, we call high Tg PCB.High TG material-selection

Hard Gold

 Usual thickness: 0.7 µm (0.00003”) to 1.3 µm (0.00005”) gold (99.7%) over 5.0

 µm (0.0002”) nickel or 0.2 µm (0.000008”) to 0.3 µm (0.00001”) gold (99.7%) over

 5.0 µm (0.0002”) nickel for a solderable surface

 Very good for corrosion resistance

 Rated at 130-220 Knoop hardness

 Very good wear resistance

 Excellent for surface rotary switches, on-off contacts, and edge connectors

 Very good shelf life

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview

Feature capabilities
Layer Count 3-60L
Available Multilayer PCB Technology Through hole with Aspect Ratio 16:1
buried and blind via
Hybrid High Frequency Material such as RO4350B and FR4 TG 180°Mix  etc.
High Speed Material such as M7NE and FR4 TG 180°Mix   etc.
Thickness 0.3mm-8mm
Minimum line Width and Space 0.05mm/0.05mm(2mil/2mil)
BGA  PITCH 0.35mm
Min mechanical Drilled Size 0.15mm(6mil)
Aspect Ratio for through hole 16:1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
Copper filled, silver filled
Registration ±4mil
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

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