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10 Layer High Tg Immersion gold Boad | YMS PCB

Short Description:

Parameters Layers: 10

Base Material:S1170

Thickness:1.6

Minimum Line Width/Clearance:0.10mm/0.10mm

Size:100mm×100mm

Aspect Ratio:16 : 1

Surface treatment:ENIG

Crafts Immersion Gold:4“ 2 Step HDI Resin Plug Hole Technology High Frequency Board

Applications:Communication


Product Detail

Product Tags

Electroless Nickel or Immersion Gold (99.9 percent Gold)

  ▪ Usual thickness is 0.08 µm or 0.000003 inch to 0.2 µm or 0.000008 inch gold over 0.5 µm or 0.0002 inch nickel

  ▪ Superior resistance from corrosion

  ▪ Adequate for aluminum wire bonding

  ▪ Very Good for the use of fine pitch technology

  ▪ Superior ability for soldering

  ▪ Very good shelf life

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