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HDI pcb any layer hdi pcb high speed insertion loss test enepig| YMSPCB

Short Description:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias. 


Layers: 12L HDI any-layer  pcb

Board Thinkness:1.6mm

Base Material:M7NE

Min Holes:0.2mm

Minimum Line Width/Clearance:0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH and Line: 0.2mm


Aspect Ratio:10 : 1

Surface treatment:ENEPIG+ Gold Finger

Speciality: Any layer hdi pcb, high speed material, hard gold plating for edge connectors,insertion loss test, Z-axis milling,Laser via copper plated shut

Special Process:Thickness of Gold finger:12“

Differential impedance 100+7/-8Ω

Applications:Optical module

Product Detail


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What is HDI PCB

HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

all via type

Advantages of HDI PCB

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

YMS HDI PCB manufacturing capabilities:

hdi pcb any layer hdi pcb high speed hard gold plating for edge connectors  gold fingers insertion loss test enepig 5+N+5+stackup

YMS HDI PCB manufacturing capabilities overview
Feature capabilities
Layer Count 4-60L
Available HDI PCB Technology 1+N+1
Any layer
Thickness 0.3mm-6mm
Minimum line Width and Space 0.05mm/0.05mm(2mil/2mil)
BGA PITCH 0.35mm
Min laser Drilled Size 0.075mm(3nil)
Min mechanical Drilled Size 0.15mm(6mil)
Aspect Ratio for laser hole 0.9:1
Aspect Ratio for through hole 16:1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
Copper filled, silver filled
Laser via copper plated shut
Registration ±4mil
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.



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