HDI pcb sembarang lapisan hdi pcb tes kecepetan kecepetan tes enepig | YMSPCB

HDI pcb sembarang lapisan hdi pcb tes kecepetan kecepetan tes enepig | Gambar Pilihan YMSPCB

Katrangan singkat:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias.

paramèter

Lapisan: 12L HDI pcb apa wae lapisan

Pikiran Papan: 1.6mm

Bahan Dasar: M7NE

Bolongan Min: 0,2mm

Jembar / reresik garis minimal: 0,075mm / 0,075mm

Reresik Minimal antarane Inner Layer PTH lan Line ： 0.2mm

Ukuran ： 107.61mm × 123.45mm

Rasio Aspek ： 10: 1

Perawatan lumahing ： ENEPIG + Driji Emas

Khusus: Lapisan hdi pcb apa wae, bahan kacepetan dhuwur, plating emas hard kanggo konektor pinggiran, tes kerugian sisipan, panggilingan sumbu Z, Laser liwat tutup tembaga

Proses khusus: kekandelan saka emas driji: 12 "

Impedansi beda 100 + 7 / -8Ω

Aplikasi: Modul optik

Kirimi email kanggo kita pancapilar

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FAQ

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Apa HDI PCB

PCB HDI Kab: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Kaluwihan HDI PCB

Alesan sing paling umum nggunakake teknologi HDI yaiku nambah kapadhetan kemasan. Ruang sing dipikolehi kanthi struktur trek sing luwih apik kasedhiya kanggo komponen. Kajaba iku, syarat ruang umume dikurangi bakal nyebabake ukuran papan sing luwih cilik lan lapisan luwih sithik.

Biasane FPGA utawa BGA kasedhiya kanthi jarak 1mm utawa kurang. Teknologi HDI nggawe gampang nuntun lan nyambungake, utamane nalika nuntun ing antarane pin.

YMS HDI PCB manufaktur :

Ringkesan kabisan pabrik YMS HDI PCB
Fitur	kapabilitas
Count Layer	4-60L
Kasedhiya Teknologi PCB HDI	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lapisan apa wae
Kandel	0.3mm-6mm
Jembar lan Spasi baris minimal	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Ukuran Bor Min laser	0.075mm (3nil)
Ukuran Bor Min mekanis	0.15mm (6mil)
Aspek Rasio kanggo bolongan laser	0,9: 1
Rasio Aspek liwat bolongan	16: 1
Lumahing Rampung	HASL, HASL, timah gratis, ENG, Timah, OSP, Silver Immersion, Driji Emas, Gold Hard Electroplating, OSP Selektif, ENEPIG.etc.
Liwat Isi Isi	Via dilapisi lan diisi epoxy konduktif utawa non-konduktif banjur ditutup lan dilapis
	Isi tembaga, perak isi
	Laser liwat tembaga dilapisi mati
Registrasi	± 4mil
Topeng Solder	Ijo, Abang, Kuning, Biru, Putih, Ireng, Ungu, Matte Ireng, Matte ijo.