Sinis HDI iacuit pcb quaelibet insitionem damnum test enepig HDI pcb summus celeritate | YMSPCB et officinas artifices | Yongmingsheng
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HDI iacuit pcb quaelibet insitionem damnum test enepig HDI pcb summus celeritate | YMSPCB

Description:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias. 

Morbi

Tutata est: quemquam 12L HDI iacuit pcb

Tabula Thinkness: 1.6mm

Basis Material: M7NE

Min egréssus: 0.2mm

Minimum line width / Clearance: 0.075mm / 0.075mm

Iacuit inter interiorem et linea PTH minimum Clearance: 0.2mm

Magnitudine: 107.61mm × 123.45mm

Aspect Ratio: X: I

Superficiem treatment: Digitus Aurum ENEPIG +

Specialty: Any iacuit pcb HDI, summus celeritas materia, ora pro dura aurum plating connexiones, insertionem damnum test,  z axem milling, operculo texit aere per Laser

Quaestionem: Aurum digito Crassitudo: XII "

Diversus IMMINENTIA VII C + / -8Ω

Applications: moduli Gallium


Product Detail

FAQ

Product Tags

Quod HDI PCB

PCB HDI: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

per omnis generis

Commoda HDI PCB

Quod maxime communi causa HDI usura is technology a significant augmentum in in packaging density. Semita in puriora in spatio adeptus is available for structurae components. Praeterea spatium totius magnitudinis opus habeant pauciores minores ordines reducuntur evenit.

Vel cum praesto sunt BGA FPGA plerumque minus 1mm vel eros nec libero. HDI technology facit fusos circa nexum et facile, praecipue cum tam paxillos inter ingratiis excitavit.

YMS HDI PCB faciens capa capacitatem capam;

HDI iacuit pcb omnibus duris aurum plating HDI pcb summus celeritate ore connexiones aurum et digitos V inserta damnum test enepig V + + + N stackup

YMS HDI PCB vestibulum elit Overview
feature facultatem
stratum comitis 4-60L
Available HDI PCB Technology I + I + N
II + + N II
III III + + N
IV + + N IV
V + + N V
accumsan nec
crassitudine 0.3mm-6mm
Vivamus ipsum aciem spatium minimum 0.05mm / 0.05mm (2mil / 2mil)
BGA CASTRA 0.35mm
Min Location laser capillus Drilled 0.075mm (3nil)
Min Location mechanica Drilled 0.15mm (6mil)
Aspect laser ratio foraminis 0,9: I
Aspect Ratio enim per foraminis XVI: I
Conclusio superficiem Removerit, removerit Category: enig, immersionis Stannum OSP immersionis argenti Digitus Aurum, Aurum Puer electroplating, electionem selectivam OSP ENEPIG.etc.
Via Bene Reple Et per hoc in patella repleti PROLIXUS vel epoxy erit PROLIXUS vel non-capped et super patella
Aere impleta implebitur pecunia
Laser aeris patella per operculi
Registration ± 4mil
Os solidaturam Viridis, Red, Yellow, cæruleus, albus, Nigrum, Purple, Matte Nigrum, Matte green.etc.

https://www.ymspcb.com/hdi-pcb-any-layer-hdi-pcb-high-speed-insertion-loss-test-enepig-ymspcb.html

https://www.ymspcb.com/hdi-pcb-any-layer-hdi-pcb-high-speed-insertion-loss-test-enepig-ymspcb.html



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