| index technica | missa Batch | parvus batch | Sample | ||
| basis Material | FR4 | normalis Tg | S1141 Shengyi, KB6160, Huazhen H140 (competit processus Category) | ||
| medio Tg | Nam HDI: multi tutata est: VS S1000H, ITEQIT158, HuazhengH150; DCLXII-Tu; | ||||
| princeps Tg | Densum aeris alta iacuit; S1000-2 SY; ITEQIT180A; HuazhengH170: ISOLA: FR408R; 370HR: Tu, DCCLII; | ||||
| Solvo halogen | Medio TG: VS S1150G, HuazhengH150HF, H160HF, princeps TG: VS S1165 | ||||
| princeps CTI | SY CTI≥600 S1600, Huazheng H1600HF, H1600A; | ||||
| princeps frequency | Rogers, Arlon, Taconic, SCGA-D agantur SY: S7136; HuazhengH5000 | ||||
| Mobilitas magna | SY S7439: 862HF, Tu, Tu, 872SLK: ISOLA: ego HONDIUS, I-tera @ MT40: Huazheng: H175: H180: H380 | ||||
| LENTO Material | Base | Glutine-libera, AK XingyangW Dupont-type: RF-Panosonic DCCLXXV; | |||
| Coverlay | SY SF305C, Q-genus Xingyang | ||||
| PP special | Non fluxus P: VI-447LF, 49n Taiguang 370BL Arlon | ||||
| Ceramic repleti sheet tenaces: Rogers4450F | |||||
| PTFE sheet tenaces: Arlon6700, Taconic XXVII-FR / NL XXVIII- | |||||
| Duplex postesque coatingPI: xingyang 1010TF-N-mb | |||||
| metallum Base | Berguist Al-basi, basi Huazheng Al-, chaosun Al-basi, copperbase | ||||
| special | Romans go home! Princeps calor resistentia ex prima hujus: Tenghui VI-CMI, Arlon 85n, S260 SV (Tg250) | ||||
| Altus scelerisque conductivity materia: 92ML | |||||
| Ceramic materia pura, ALUMEN tellus, Aluminium nitride LATERAMEN | |||||
| B. materia: Nanya NGP Taiwan-200WT | |||||
| stratis | FR4 | 36 | 60 | 140 | |
| Seu Rigidorum VOL & LENTO / (LENTO) | XVI (VI) | XVI (VI) | XXIV (VI) | ||
| Mixta princeps frequency Lamination | 12 | 12 | 20 | ||
| % C PTFE | 6 | 6 | 10 | ||
| HDI | II gradibus | III gradibus | IV gradus | ||
| Index technica | missa Batch | parvus Batch | Sample | ||
| Location Delivery | Max (mm) | * CDLX DLX | * CDLX DLX | DL * CM | |
| (Mm) | Sumus (mm) | XX XX * | X * X | V X * | |
| Width / Gap | Interiore (t) | 0.5oz basi aeris, aeris 3/3 1.0oz basi, basi aeris 2.0oz 4/4: 5/6 | |||
| 3.0OZ basi aeris, aeris 7/9 4.0oz basi, basi aeris 5.0OZ 8/12: 10/15 | |||||
| 6.0OZ aeris basi, basi OZ X 12/18 aeris, aeris basi OZ XII 18/24, 20/28 | |||||
| Exteriora (t) | I / 3oz basi aeris, aeris 3/3 0.5oz basi, basi aeris 1.0oz 4/4: 5/5 | ||||
| 2.0oz basi aeris, aeris 6/8 3.0OZ basi, basi aeris 4.0oz 7/10: 8/13 | |||||
| 5.0OZ basi aeris, aeris 10/16 6.0OZ basi, basi aeris OZ X 12/18, 18/24 | |||||
| XII OZ aeris basi, basi aeris OZ XV 20/28, 24/32 | |||||
| Latitudo linea TOLERATIO | > Mil 5.0 | ° XX% | ° XX% | ± 1.0mil | |
| ≤5.0 mit | ± 1.0mil | ± 1.0mil | ± 1.0mil | ||
| EXERCITATIO | Min laser (mm) | 0,1 | 0,1 | 0,1 | |
| Cnc min (mm) | 0,2 | 0.15 | 0.15 | ||
| Cnc terebro frenum max (mm) | 6,5 | 6,5 | 6,5 | ||
| Half Centenionalis min Sanctus (mm) | 0,5 | 0,4 | 0,4 | ||
| PTH Sanctus (mm) | normalem | ± 0.1 | 0.075 ° | 0.075 ° | |
| Sanctus hodie premunt, | ± 0,05 | ± 0,05 | ± 0,05 | ||
| Angulus foraminis (conicum) | Diameter≤6.5mm superius mensuram latitudinis templi: 800,900,1000,1100: diameter≥6.5mm superius mensuram latitudinis templi: CM; | ||||
| EXERCITATIO profundum de praecisione-control (mm) | ± 0,10 | 0.075 ° | ± 0,05 | ||
| Hinc caecis multis foraminibus cnc | ≤2 | ≤3 | ≤4 | ||
| Per eros nec minimum foraminis (alia network, militum, medicinae, automobile) mm | 0,5 | 0,45 | 0,4 | ||
| Per eros nec minimum foraminis (alia network, et potestatem Generalis industriae electronic dolor) mm | 0,4 | 0,35 | 0,3 | ||
| index technica | missa batch | parvus batch | sample | ||
| EXERCITATIO | Foramen in pariete foramen minimum spatio ad (idem ipsum mm) | 0,2 | 0,2 | 0.15 | |
| Minimum foramen parietis color (mm) foramina pro fabrica | 0,8 | 0,7 | 0,7 | ||
| Aera per foramen interius minimum distat linea | 0,2 | 0,18 | ≤10L: 0.15 | ||
| > 10L: 0,18 | |||||
| Fabrica foramen versus ab interioribus cuprum ad min | 0,3 | 0,27 | 0,25 | ||
| Welding Orbis | via foraminis | IV (HDI 3mil) | 3.5 (HDI 3mil) | 3 | |
| (Mil) | pars foraminis | 8 | 6 | 6 | |
| Dam solidabis (mil) | (Solidabis per persona) | 5 | 4 | 4 | |
| (Species) | 6 | 5 | 5 | ||
| Crassitudo ultima Board | > 1,0 mm | ± X% | ± VIII% | ± VIII% | |
| ≤1.0 mm | ± 0.1mm | ± 0.1mm | ± 0.1mm | ||
| Tabula crassitudine (mm) | 0.5-5.0 | 0.4-6.5 | 0.3-11.5 | ||
| Tabula crassitudine / terebro frenum | 10:01:00 | 12:01:00 | 13:01:00 | ||
| Via foraminis (terebro frenum), plug foramen (obturaculum solidaturam) | 0.25-0.5mm | 0.20-0.5mm | 0.15-0.6mm | ||
| Cæcus buried foraminis, in medio foraminis pad | 0.25-0.5mm | 0.20-0.5mm | 0.10-0.6mm | ||
| Arcum retorquebit | ≤0.75% | ≤0.75% | ≤0.5% | ||
| Imperium IMMINENTIA | ≥5.0mil | ± X% | ± X% | ± VIII% | |
| <5.0mil | ± X% | ± X% | ± X% | ||
| cnc | FORMA tolerantia (mm) | ± 0.15 | ± 0,10 | ± 0,10 | |
| RELICTUM crassitudine de V argutus TOLERATIO (mm) | ± 0.15 | ± 0,10 | ± 0,10 | ||
| Socors fuso (mm) | ± 0.15 | ± 0,10 | ± 0,10 | ||
| Subtilitas sobrie altum milling (mm) | ± 0.15 | ± 0,10 | ± 0,10 | ||
| index technica | missa batch | parvus batch | sample | ||
| CIRCUMCAESURA | ora revellere coneris; | XX ~ LX gradus; ± 5degree | |||
| superficies curatio | immersionis auri | Ni crassitudine (Micro-inch) | 118-236 | 118-236 | 118-236 |
| Aurum max (uinch) | 3 | 3 | 6 | ||
| Durum aurum (Au densissima) | Aurum digitus (uinch) | 15 | 30 | 60 | |
| NiPdAu | NI (uinch) | 118-236 | |||
| PA (uinch) | 2-5 | ||||
| Au (uinch) | 1-5 | ||||
| Aliquam lacinia purus aurum electrica | NI (uinch) | 120-400 | |||
| AU (uinch) | 1-3 | ||||
| immersionis stagni | Tin (um) | 0.8-1.2 | |||
| A g immersionis | AG (uinch) | 6-10 | |||
| OSP | densissima (um) | 0.2-0.5 | |||
| HAL / IF HAL | BGApad (mm) | ≥0.3 × 0,3 | |||
| crassitudine (mm) | 0.6≤H≤3.0 | ||||
| Tabula crassitudine foraminis diameter nobis | Hole≤3 Press: I | ||||
| Tin (um) | 2.0-40.0 | ||||
| Seu Rigidorum VOL & LENTO | Maxime in crassitudine dielectric inflectere | -Free gluten 25um | Glutine-libera 75um | Glutine-free75um | |
| LENTO parte width (mm) | ≥10 | ≥5 | ≥5 | ||
| Max partus magnitudine (mm) | CC CD × | CC × D | CD × DL | ||
| in via procul in ore foraminis & inflectere Seu Rigidorum VOL (mm) | ≥1.2 | ≥1.0 | ≥0.8 | ||
| (Mm) ex spatio, ut in ore foraminis components R & F | ≥1.5 | ≥1.2 | ≥1.0 | ||
| index technica | missa batch | parvus batch | sample | ||
| Seu Rigidorum VOL & LENTO | structure | Tegumen inflectere structuram ex parte, quod equites ex prima hujus structuram et contentiones et divisiones novit compages | Aluminium secundum inflectere rigidis, dorso subnigrae inflectere HDI: combination, film protegit electromagneticis constringitur | ||
| Tech special | Back diam PCB, metallum Sandwico, buried aeris crassitudine foraminis cæcus, gradus socors, dist foraminis, dimidium foraminis, mixta lamination | Buried magnetica core PCB | Buried capacitor / resistor, in partem aeris regio embedded, Ceramic C% PCB, nut buried riveting PCB, embedded components PCB | ||
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