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HDI pcb 3+N+3 Laser via copper plated shut Castellated Hole| YMSPCB

Short Description:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias. 

Parameters

Layers: 14L HDI pcb

Board Thinkness:2.0mm

Base Material:IT180A

Min Holes:0.2mm

Minimum Line Width/Clearance:0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH and Line: 0.2mm

Size:143.451mm×120.45mm

Aspect Ratio:10 : 1

Surface treatment:ENEPIG

Speciality: Laser via copper plated shut,Castellated Hole

Differential impedance 100+7/-8Ω

Applications:Communication


Product Detail

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What is  HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI enables the connection between any layers;

2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.

HDI PCB

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB manufacturing capabilities overview
Feature capabilities
Layer Count 4-60L
Available HDI PCB Technology 1+N+1
2+N+2
3+N+3
4+N+4
5+N+5
Any layer
Thickness 0.3mm-6mm
Minimum line Width and Space 0.05mm/0.05mm(2mil/2mil)
BGA PITCH 0.35mm
Min laser Drilled Size 0.075mm(3nil)
Min mechanical Drilled Size 0.15mm(6mil)
Aspect Ratio for laser hole 0.9:1
Aspect Ratio for through hole 16:1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
Copper filled, silver filled
Laser via copper plated shut
Registration ±4mil
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.




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