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HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Short Description:

HDI printed circuit boards offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parameters

Layers: 12

Base Material:FR4 High Tg EM827

Thickness:1.2±0.1mm

Min.Hole Size:0.15mm

Minimum Line Width/Space:0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH and Line: 0.2mm

Size:101mm×55mm

Aspect Ratio:8 : 1

Surface treatment:ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applications:Telecommunication


Product Detail

Product Tags

What is  HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI enables the connection between any layers;

2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.

HDI PCB

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB manufacturing capabilities overview
Feature capabilities
Layer Count 4-60L
Available HDI PCB Technology 1+N+1
2+N+2
3+N+3
4+N+4
5+N+5
Any layer
Thickness 0.3mm-6mm
Minimum line Width and Space 0.05mm/0.05mm(2mil/2mil)
BGA PITCH 0.35mm
Min laser Drilled Size 0.075mm(3nil)
Min mechanical Drilled Size 0.15mm(6mil)
Aspect Ratio for laser hole 0.9:1
Aspect Ratio for through hole 16:1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
Copper filled, silver filled
Laser via copper plated shut
Registration ±4mil
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

You May Like:

1、The application range and circuit advantage of HDI board are introduced

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3、PCB design of 1 step, 2 step and 3step HDI





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