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12 Layer 2 Step HDI Board | YMS PCB

Short Description:


Layers: 12


Min.Hole Size:0.1mm

Minimum Line Width/Space:0.10mm/0.10mm


Surface treatment:ENIG


2 Step HDI Board

electriplating filling

Resin Plug Hole Technology


Product Detail

Product Tags

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI enables the connection between any layers;

2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.

You May Like:

1、The application range and circuit advantage of HDI board are introduced

2、PCB production skills: HDI board CAM production method

3、PCB design of 1 step, 2 step and 3step HDI

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