HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Kort beskrywing:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

'N HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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produk Detail

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produk Tags

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Lae: 12

Base Material:FR4 High Tg EM827

Dikte ： 1,2 ± 0,1 mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Minimum opruiming tussen binnelaag PTH en lyn ： 0,2 mm

Size：101mm×55mm

Aspek verhouding: 8: 1

Oppervlak behandeling: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aansoeke: Telekommunikasie

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-stap HDI in staat stel om die verband tussen enige lae;

2.Cross-laag laser verwerking kan die kwaliteit vlak van multi-stap HDI verbeter;

3. Die kombinasie van HBI en 'n hoë-frekwensie materiaal,-metaal gebaseer lamin, ODC en ander spesiale lamin en prosesse staat stel om die behoeftes van 'n hoë digtheid en 'n hoë frekwensie, hoë hitte geleidende, of 3D vergadering.

YMS HDI PCB vervaardigingsvermoë :

YMS HDI PCB vervaardigingsmoontlikhede oorsig
Funksie	vermoëns
Laagtelling	4-60L
Beskikbaar HDI PCB-tegnologie	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Enige laag
Dikte	0,3 mm-6 mm
Minimum lynbreedte en spasie	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Min laser geboorde grootte	0,075 mm (3nul)
Min meganiese geboorde grootte	0.15mm (6mil)
Beeldverhouding vir lasergat	0,9: 1
Beeldverhouding vir deurgat	16: 1
Oppervlak afwerking	HASL, loodvrye HASL, ENIG, onderdompeltin, OSP, onderdompelingsilwer, goue vinger, galvanisering hardgoud, selektiewe OSP ， ENEPIG.etc.
Via vulopsie	Die via is oorgetrek en gevul met geleidende of nie-geleidende epoksie, dan bedek en oorgetrek
	Koper gevul, silwer gevul
	Laser via koper oorgetrek
Registrasie	± 4mil
Soldeermasker	Groen, Rooi, Geel, Blou, Wit, Swart, Pers, Mat Swart, Matgroen. Ens.