HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Qisqa Tasvir:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

An HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

Bizga elektron pochta yuborish PDF sifatida yuklab

Mahsulot batafsil

Tss

Mahsulot teglar

Parameters

Qatlamlari: 12

Base Material:FR4 High Tg EM827

Qalinligi: 1,2 ± 0,1 mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Ichki qatlam PTH va chiziq orasidagi minimal bo'shliq: 0,2 mm

Size：101mm×55mm

Eng Mana darajasi: 8: 1

Er ishlash: beradi EniG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Ilovalar: Telekommunikatsiya

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-qadam O'zTTBRM har qanday qatlamlari o'rtasida bog'liqlik beradi;

2.Cross-qatlam lazer ishlash nechta qadam Inson taraqqiyoti indeksi sifat darajasini oshirish mumkin;

O'zTTBRM va yuqori chastotali materiallar, metall asoslangan laminat, FPC va boshqa maxsus laminat va jarayonlarning 3. birikmasi yuqori zichligi va yuqori chastotali, yuqori issiqlik o'tkazish, yoki 3D montaj ehtiyojlarini beradi.

YMS HDI PCB ishlab chiqarish kapitali :

YMS HDI PCB ishlab chiqarish imkoniyatlariga umumiy nuqtai
Xususiyat	imkoniyatlar
Qatlamlarni hisoblash	4-60L
Mavjud HDI PCB texnologiyasi	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Har qanday qatlam
Qalinligi	0,3 mm-6 mm
Minimal chiziq kengligi va bo'sh joy	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA PITCH	0,35 mm
Minimal lazerli burg'ulash hajmi	0,075 mm (3 nil)
Eng kam mexanik burg'ulash hajmi	0,15 mm (6 mil)
Lazer teshigi uchun nisbati	0.9: 1
Teshikning nisbati	16: 1
Yuzaki tugatish	HASL, qo'rg'oshinsiz HASL, ENIG, immersion qalay, OSP, immersion kumush, oltin barmoq, elektrokaplama qattiq oltin, selektiv OSP ， ENEPIG.etc.
To'ldirish opsiyasi orqali	Orqali qoplanadi va o'tkazuvchan yoki o'tkazmaydigan epoksi bilan to'ldiriladi, so'ngra yopiladi va qoplanadi
	Mis bilan to'ldirilgan, kumush bilan to'ldirilgan
	Mis bilan qoplangan lazer yordamida yopish
Ro'yxatdan o'tish	± 4 mil
Lehim maskasi	Yashil, qizil, sariq, moviy, oq, qora, binafsha, mat qora, mat yashil va boshqalar.