HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Deskripsi Singkat:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

Sebuah HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Rincian produk

FAQ

Tags produk

parameter

Lapisan: 12

Base Material:FR4 High Tg EM827

Ketebalan: 1.2 ± 0.1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Jarak Bebas Minimum antara PTH Lapisan Dalam dan Garis ： 0.2mm

Size：101mm×55mm

Aspect Ratio: 8: 1

Permukaan pengobatan: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikasi: Telekomunikasi

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-langkah HDI memungkinkan hubungan antara setiap lapisan;

2.Cross-layer pengolahan laser dapat meningkatkan tingkat kualitas multi-langkah HDI;

Kombinasi 3. HDI dan bahan frekuensi tinggi, laminasi berbasis logam, FPC dan laminasi khusus lainnya dan proses memungkinkan kebutuhan kepadatan tinggi dan frekuensi tinggi, budidaya panas tinggi, atau perakitan 3D.

Kemampuan manufaktur YMS HDI PCB :

Ikhtisar kapabilitas manufaktur YMS HDI PCB
Fitur	kemampuan
Jumlah Lapisan	4-60L
Tersedia Teknologi HDI PCB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lapisan apa saja
Ketebalan	0,3 mm-6 mm
Lebar dan Spasi Garis Minimum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Ukuran Bor Laser Min	0,075mm (3nil)
Ukuran Bor mekanik Min	0,15 mm (6mil)
Rasio Aspek untuk lubang laser	0,9: 1
Rasio Aspek untuk lubang tembus	16: 1
Permukaan Selesai	HASL, HASL bebas timah, ENIG, Timah Perendaman, OSP, Perak Perendaman, Jari Emas, Emas Keras Elektroplating, OSP Selektif, ENEPIG.etc.
Melalui Opsi Isi	Jalur via dilapisi dan diisi dengan epoksi konduktif atau non-konduktif kemudian ditutup dan dilapisi
	Isi tembaga, isi perak
	Laser melalui tutup berlapis tembaga
Registrasi	± 4mil
Topeng solder	Hijau, Merah, Kuning, Biru, Putih, Hitam, Ungu, Matte Black, Matte green. Dll.