HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Pōkole Description:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

Loaʻa i kahi ʻO HDI PCB ka PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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ʻIke kikoʻī

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kiko'î

Papa: 12

Base Material:FR4 High Tg EM827

Mānoanoa: 1.2 ± 0.1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Ka ʻoluʻolu liʻiliʻi ma waena o ka papa o ka hohonu PTH a me ka laina: 0.2mm

Size：101mm×55mm

Lākiō hiʻohiʻona: 8: 1

ʻIlikai lapaʻau: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Noi: kelekaʻaʻike

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the ʻO HDI PCB ka PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-ʻanuʻu HDI mau hiʻohiʻona nō i ka pilina ma waena o kekahi papa;

2.Cross-, ahu iho kukuna aaioee hiki ka hōʻoi 'i ka pono nui o ka nunui-ʻanuʻu HDI;

3.The me ka hui pu ana o HDI a me kiʻekiʻe-alapine (frequency) kumuhana, metala-ma muli laminates, FPC a me nā kūikawā laminates a me keʻano o ka hanaʻana hiki ai i na mea e pono ai o kiʻekiʻe nuʻa a me kiʻekiʻe alapine (frequency), kiʻekiʻe ka wela 'ana i lawelawe, a me 3Dʻaha kanaka.

Hana ʻo YMS HDI PCB hana capa :

ʻO YMS HDI PCB hana hana nānā ākea
Hiʻona	nā hiki
Helu Layer	4-60L
Loaʻa HDI ʻenehana HDB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Kekahi papa
Mānoanoa	0.3mm-6mm
Ka laina liʻiliʻi loa a me ka lewa	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min kukuna ʻeli ʻia ka nui	0.075mm (3nil)
Min mīkini ʻeli ka nui	0.15mm (6mil)
Lākiō hiʻohiʻona no ka puka kukuna	0.9: 1
Lākiō hiʻohiʻona no ma o ka puka	16: 1
ʻIli Pau	HASL, Alakai manuahi HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc.
Via Hoʻopiha Hoʻopiha	Hoʻopili ʻia ka via a hoʻopiha ʻia me kekahi epoxy conductive a i ʻole non-conductive a laila kāpili ʻia a uhi ʻia i luna
	Piha keleawe, hoʻopiha kālā
	Paʻa ʻia ka laser ma o ke keleawe
Kakau inoa	± 4milā
Makakiʻi paukū	ʻŌmaʻomaʻo, ʻulaʻula, melemele, polū, keʻokeʻo, ʻeleʻele, poni, Matte ʻeleʻele, Matte ʻōmaʻomaʻo.