HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Kuerz Beschreiwung:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

En HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Produit Gouschteng:

FAQ

Produit Tags

Parameteren

Schichten: 12

Base Material:FR4 High Tg EM827

Déck ： 1,2 ± 0,1 mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Mindest Clearance tëscht Banneschicht PTH a Linn ： 0.2mm

Size：101mm×55mm

Aspekt Verhältnis: 8: 1

Uewerfläch Behandlung: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Uwendungen: Telekommunikatioun

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-Schrëtt HDI erméiglecht d'Verbindung tëschent all Schichten;

2.Cross-Layer kann Laser Veraarbechtung der Qualitéit Niveau vun Multi-Schrëtt HDI verbesseren;

3.The Kombinatioun vun HDI an héich-Frequenz Material, Metal-baséiert T, FPC an anere speziellen T a Prozesser aktivéiert de Besoine vun héich Dicht an héich Frequenz, héich Hëtzt Dirigent, oder 3D Versammlung.

YMS HDI PCB Fabrikatiounskapazitéiten :

YMS HDI PCB Fabrikatiounsfäegkeeten Iwwersiicht
Fonktioun	Fäegkeeten
Schicht Grof	4-60L
Verfügbar HDI PCB Technologie	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	All Schicht
Déck	0.3mm-6mm
Minimum Linn Breet a Weltraum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Min Laser Gebuert Gréisst	0,075mm (3null)
Min mechanesch Boormooss	0.15mm (6mil)
Aspekt Verhältnis fir Laser Lach	0,9: 1
Aspekt Verhältnis fir duerch Lach	16: 1
Uewerfläch fäerdeg	HASL, Bläifräien HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Galvaniséierung Hard Gold, Selektiv OSP ， ENEPIG.etc.
Iwwer Fill Optioun	De via ass plated a gefëllt mat entweder leitend oder net-leitend Epoxy, duerno ofgedeckt a plated
	Kupfer gefëllt, sëlwer gefëllt
	Laser iwwer Kupfer plated zou
Umeldung	± 4mil
Solder Mask	Gréng, Rout, Giel, Blo, Wäiss, Schwaarz, Purpur, Matt Schwaarz, Matt Gréng.