HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Kuerz Beschreiwung:

HDI gedréckte Circuit Conseils offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parameteren

Schichten: 8

Base Material:FR4 High Tg EM827

Deck: 1,6 ± 0.10mm

Min.Hole Size：0.15mm

Minimum Linn Breet / Space: 0.10mm / 0.10mm

Mindest Clearance tëscht Banneschicht PTH a Linn ： 0.2mm

Gréisst: 222mm × 120mm

Aspect Ratio：10.6 : 1

Uewerfläch Behandlung: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Uwendungen: Computer

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Produit Gouschteng:

FAQ

Produit Tags

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Verwaltungsrot Produktioun Prozess:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Op der ganzer, ass d'Produktioun vun HDI Risotto Komplex, deen no oft vun Produktioun fir eng laang Zäit fäerdeg ze ginn brauch. Et ass net nëmmen héich Ufuerderunge fir d'Genauegkeet an Agoen Kontroll vun all futti, awer och héich Standarden an Material, Equipement, Emwelt an technesch Personal.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB Fabrikatiounsfäegkeeten Iwwersiicht
Fonktioun	Fäegkeeten
Schicht Grof	4-60L
Verfügbar HDI PCB Technologie	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	All Schicht
Déck	0.3mm-6mm
Minimum Linn Breet a Weltraum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Min Laser Gebuert Gréisst	0,075mm (3null)
Min mechanesch Boormooss	0.15mm (6mil)
Aspekt Verhältnis fir Laser Lach	0,9: 1
Aspekt Verhältnis fir duerch Lach	16: 1
Uewerfläch fäerdeg	HASL, Bläifräien HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Galvaniséierung Hard Gold, Selektiv OSP ， ENEPIG.etc.
Iwwer Fill Optioun	De via ass plated a gefëllt mat entweder leitend oder net-leitend Epoxy, duerno ofgedeckt a plated
	Kupfer gefëllt, sëlwer gefëllt
	Laser iwwer Kupfer plated zou
Umeldung	± 4mil
Solder Mask	Gréng, Rout, Giel, Blo, Wäiss, Schwaarz, Purpur, Matt Schwaarz, Matt Gréng.