HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Scurta descriere:

Plăci cu circuite imprimate HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parametrii

Straturi: 8

Base Material:FR4 High Tg EM827

Grosime: 1,6 ± 0.10mm

Min.Hole Size：0.15mm

Minim Linie Lățime / Spațiu: 0.10mm / 0.10mm

Distanța minimă între stratul interior PTH și linia ： 0,2 mm

Dimensiune: 222mm x 120mm

Aspect Ratio：10.6 : 1

tratament de suprafață: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplicații: Computer

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Detaliile produsului

FAQ

Tag-uri produs

PCB HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Consiliul de procesul de producție:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Pe ansamblu, procesul de producție a plăcii IDU este complexă, care trebuie să fie finalizat după mai multe ori de producție pentru o lungă perioadă de timp. Nu este numai cerințe ridicate pentru controlul preciziei și contracția fiecărui strat, dar, de asemenea, standarde ridicate în materiale, echipamente, mediu și personal tehnic.

YMS HDI PCB manufacturing capabilities:

Prezentare generală a capacităților de fabricație PCB YMS HDI
Caracteristică	capacități
Numărul de straturi	4-60L
Tehnologie PCB HDI disponibilă	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Orice strat
Grosime	0.3mm-6mm
Lățimea și spațiul minim al liniei	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Dimensiune minimă găurită cu laser	0,075 mm (3nil)
Dimensiune minimă găurită mecanic	0.15mm (6mil)
Raport de aspect pentru gaura laser	0.9: 1
Raport de aspect pentru gaura de trecere	16: 1
Finisaj de suprafață	HASL, HASL fără plumb, ENIG, tablă de imersie, OSP, argint de imersie, deget de aur, galvanizare aur dur, OSP selectiv ， ENEPIG.etc.
Opțiunea de umplere	Via este placată și umplută cu epoxid conductiv sau neconductiv, apoi acoperită și placată
	Umplut cu cupru, umplut cu argint
	Laser prin închidere placată cu cupru
Înregistrare	± 4mil
Masca de sudura	Verde, roșu, galben, albastru, alb, negru, violet, negru mat, verde mat etc.