HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Penerangan Ringkas:

Papan litar bercetak HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parameter

Lapisan: 8

Base Material:FR4 High Tg EM827

Ketebalan: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Lebar Line Minimum / ruang: 0.10mm / 0.10mm

Pelepasan minimum antara Lapisan Dalam PTH dan Garis: 0.2mm

Saiz: 222mm × 120mm

Aspect Ratio：10.6 : 1

Rawatan permukaan: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikasi: Computer

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Detail produk

Soalan Lazim

produk Tags

PCB HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

proses pengeluaran HDI Lembaga Pengarah:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Secara keseluruhannya, proses pengeluaran plat HDI adalah kompleks, yang perlu disiapkan selepas banyak kali pengeluaran untuk masa yang lama. Ia bukan sahaja keperluan yang tinggi untuk ketepatan dan pengecutan kawalan setiap lapisan, tetapi juga standard yang tinggi dalam bahan-bahan, peralatan, alam sekitar dan kakitangan teknikal.

YMS HDI PCB manufacturing capabilities:

Gambaran keseluruhan keupayaan pembuatan YMS HDI PCB
Ciri	kemampuan
Kiraan Lapisan	4-60L
Teknologi PCB HDI yang ada	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lapisan apa pun
Ketebalan	0.3mm-6mm
Lebar dan Ruang Garisan minimum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Saiz Penggerudian laser Min	0.075mm (3nil)
Saiz Penggerudian Min mekanikal	0.15mm (6 juta)
Nisbah Aspek untuk lubang laser	0.9: 1
Nisbah Aspek untuk lubang melalui	16: 1
Kemasan Permukaan	HASL, HASL bebas timbal, ENIG, Timah rendaman, OSP, Perak rendaman, Jari emas, Emas keras penyaduran, OSP terpilih ， ENEPIG.etc.
Melalui Pilihan Isi	Jalur disalut dan diisi dengan epoksi konduktif atau tidak konduktif kemudian ditutup dan disalut
	Tembaga diisi, perak diisi
	Laser melalui penutup berlapis tembaga
Pendaftaran	± 4 juta
Topeng Pateri	Hijau, Merah, Kuning, Biru, Putih, Hitam, Ungu, Matte Hitam, Matte hijau.etc.