HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

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Plaques de circuits impresos HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

paràmetres

Capes: 8

Base Material:FR4 High Tg EM827

Gruix: 1,6 ± 0,10 mm

Min.Hole Size：0.15mm

Mínim d'ample de línia / espai: 0,10 mm / 0,10 mm

Distància mínima entre la capa interior PTH i la línia ： 0,2 mm

Mida: 222mm x 120mm

Aspect Ratio：10.6 : 1

Tractament de la superfície: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplicacions: Informàtica

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PCB HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

Junta IDH procés de producció:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

En general, el procés de producció de la placa IDH és complexa, que ha de ser completat després de molts moments de la producció durant molt de temps. És no només els alts requisits per a la precisió i la contracció de control de cada capa, sinó també un alt nivell de materials, equips, el medi ambient i el personal tècnic.

YMS HDI PCB manufacturing capabilities:

Descripció general de les capacitats de fabricació de PCB YMS HDI
Funció	capacitats
Recompte de capes	4-60L
Tecnologia de PCB HDI disponible	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Qualsevol capa
Gruix	0,3 mm-6 mm
Amplada i espai mínim de la línia	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA PITCH	0,35 mm
Mida mínima perforada amb làser	0,075 mm (3nil)
Mida mínima perforada mecànica	0,15 mm (6 mil)
Relació d'aspecte del forat làser	0,9: 1
Relació d'aspecte per al forat passant	16: 1
Acabat superficial	HASL, HASL sense plom, ENIG, llauna d’immersió, OSP, plata d’immersió, dit d’or, daurat galvanitzat, OSP selectiu ， ENEPIG.etc.
Opció d'emplenament mitjançant	La via es xapa i s’omple amb epoxi conductor o no conductor i després es tapa i es xapa
	Farcit de coure, farcit de plata
	Làser tancat amb coure
Inscripció	± 4mil
Màscara de soldadura	Verd, vermell, groc, blau, blanc, negre, morat, negre mat, verd mat, etc.