HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Kout Deskripsyon:

HDI ankadreman sikwi enprime offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

paramèt

Kouch: 8

Base Material:FR4 High Tg EM827

Epesè: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimòm Line Lajè / espas: 0.10mm / 0.10mm

Clearance Minimòm ant Inner Kouch PTH ak Liy ： 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

tretman sifas: Enig

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikasyon: Odinatè

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pwodwi Detay

FAQ

pwodwi baj

HDI pkb is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Komisyon Konsèy pwosesis pwodiksyon:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Sou tout la, pwosesis pwodiksyon an nan plak HDI se konplèks, ki bezwen yo dwe ranpli apre anpil tan nan pwodiksyon pou yon tan long. Li pa sèlman segondè kondisyon pou presizyon ak kontraksyon kontwòl la nan chak kouch, men tou, estanda ki wo nan materyèl, ekipman, anviwònman ak pèsonèl teknik.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB fabrikasyon kapasite BECA
Karakteristik	kapasite
Kouch Konte	4-60L
Disponib HDI PCB Teknoloji	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Nenpòt kouch
Epesè	0.3mm-6mm
Minimòm liy lajè ak espas	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min lazè komanse fouye gwosè	0.075mm (3nil)
Min mekanik gwosè komanse fouye	0.15mm (6mil)
Aspè Pwopòsyon pou twou lazè	0.9: 1
Aspè Pwopòsyon pou nan twou	16: 1
Sifas Fini	HASL, plon gratis HASL, ENIG, eten imèsyon, OSP, ajan imèsyon, dwèt lò, galvanoplastie difisil lò, selektif OSP ， ENEPIG.etc.
Via Ranpli Opsyon	Via a se plake ak plen ak swa konduktif oswa ki pa kondiktif epoksidik Lè sa a, capped ak plake sou
	Kuiv plen, ajan plen
	Lazè atravè kwiv plake fèmen
Enskripsyon	± 4mil
Mask soude	Vèt, Wouj, Jòn, Blue, Blan, Nwa, Koulè wouj violèt, Matte Nwa, Matte green.etc.