China HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB factory and manufacturers | Yongmingsheng
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HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Description:

HDI circa tabulas typis offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Morbi

Stratis: VIII

Base Material:FR4 High Tg EM827

Crassitudine: ± 1.6 0.10mm

Min.Hole Size:0.15mm

Minimum line width / Tractus: 0.10mm / 0.10mm

Iacuit inter interiorem et linea PTH minimum Clearance: 0.2mm

Magnitudine: 222mm x 120mm

Aspect Ratio:10.6 : 1

Superficiem treatment: enig

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applications: Computer


Product Detail

FAQ

Product Tags

PCB HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board productio processus:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Omnis productio processus hdi catillus complexu multa quae ad productionem diu perfectum. Non solum requiruntur ad hoc princeps accurate imperium et DECREMENTUM singulis iacuit, sed etiam materiae, in alta signa, apparatu, elit et technicae curatores.

PCB HDI

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB vestibulum elit Overview
feature facultatem
stratum comitis 4-60L
Available HDI PCB Technology I + I + N
II + + N II
III III + + N
IV + + N IV
V + + N V
accumsan nec
crassitudine 0.3mm-6mm
Vivamus ipsum aciem spatium minimum 0.05mm / 0.05mm (2mil / 2mil)
BGA CASTRA 0.35mm
Min Location laser capillus Drilled 0.075mm (3nil)
Min Location mechanica Drilled 0.15mm (6mil)
Aspect laser ratio foraminis 0,9: I
Aspect Ratio enim per foraminis XVI: I
Conclusio superficiem Removerit, removerit Category: enig, immersionis Stannum OSP immersionis argenti Digitus Aurum, Aurum Puer electroplating, electionem selectivam OSP ENEPIG.etc.
Via Bene Reple Et per hoc in patella repleti PROLIXUS vel epoxy erit PROLIXUS vel non-capped et super patella
Aere impleta implebitur pecunia
Laser aeris patella per operculi
Registration ± 4mil
Os solidaturam Viridis, Red, Yellow, cæruleus, albus, Nigrum, Purple, Matte Nigrum, Matte green.etc.


https://www.ymspcb.com/8-layer-2-step-hdi-board-yms-pcb.html



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  • What is HDI material?

    FR4 Fiberglass board or ceramic board

    Are printed circuit boards still used?

    Yes,the Printed circuit board(PCB) is the foundation of electronic equipment, and it can be found in every electronic device in today ’s world

    What is the major disadvantage of printed circuit boards?

    1.single use 2.environmental pollution 3.high cost

    Is there gold in printed circuit boards?

    yes,there is

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