HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Short Bayani:

HDI buga allon kewayawa offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

sigogi

Ƙasansu akwai waɗansu inuwõwi: 8

Base Material:FR4 High Tg EM827

Kauri: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Mafi qarancin Line Nisa / Space: 0.10mm / 0.10mm

Arancin Sharewa tsakanin Inner Layer PTH da Layin ： 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

Surface jiyya: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aikace-aikace: Kwamfuta

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samfurin Detail

Tambayoyi

samfurin Tags

Farashin PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board samar da tsari:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

A kan dukan, da samar da tsari na HDI farantin ne hadaddun, wanda bukatar a kammala bayan sau da yawa na samar na dogon lokaci. Yana ba kawai high bukatun ga daidaito da kuma shrinkage iko da kowane Layer, amma kuma babban matsayin da kayan, kayan aiki, yanayi da kuma fasaha ma'aikata.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB damar duba abubuwa
Fasali	damar
Countididdigar Layer	4-60L
Akwai HDI PCB Fasaha	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Duk wani Layer
Kauri	0.3mm-6mm
Ananan Layin Faɗi da Sarari	0.05mm / 0.05mm (2mil / 2mil)
FITAR BGA	0.35mm
Min Laser Harshen Girman	0.075mm (3nil)
Min Girman Hannun injina	0.15mm (6mil)
Ra'ayin ƙasa don ramin laser	0.9: 1
Ra'ayin ƙasa don rami	16: 1
Gama Gama	HASL, Jagora kyauta HASL, ENIG, Nitsar da Tin, OSP, Azurfar Nutsewa, Yatsan Zinare, Gyara Zinariya Mai Wuya, Mai Zaba OSP ， ENEPIG.etc.
Ta Hanyar Cika zaɓi	An lika abin da ke ciki kuma an cika shi da mai sarrafawa ko wanda ba zai iya sarrafawa ba sannan a rufe shi
	An cika tagulla, an cika azurfa
	Laser ta hanyar rufe farin ƙarfe
Rijista	± 4mil
Masassarar Solder	Kore, Ja, Rawaya, Shuɗi, Fari, Baƙi, Mai Tsara, Matta Baki, Matte kore. Da dai sauransu.