China HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB factory and manufacturers | Yongmingsheng
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HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Brève description:

circuits imprimés HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Paramètres

Couches: 8

Base Material:FR4 High Tg EM827

Epaisseur: 1,6 ± 0,10 mm

Min.Hole Size:0.15mm

Ligne minimum Largeur / Espace: 0.10mm / 0.10mm

Dégagement minimum entre la couche intérieure PTH et la ligne : 0,2 mm

Taille: 222mm × 120mm

Aspect Ratio:10.6 : 1

Traitement de surface: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applications: Ordinateur


Détail du produit

FAQ

Mots clés du produit

PCB HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

processus de production Conseil IDH:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Dans l'ensemble, le processus de production de la plaque HDI est complexe, qui doit être achevé après plusieurs périodes de production pendant une longue période. Il est non seulement des exigences élevées pour le contrôle de la précision et le retrait de chaque couche, mais aussi des normes élevées dans les matériaux, l'équipement, l'environnement et le personnel technique.

PCB HDI

YMS HDI PCB manufacturing capabilities:

Présentation des capacités de fabrication de circuits imprimés YMS HDI
Fonctionnalité capacités
Nombre de couches 4-60L
Technologie PCB HDI disponible 1 + N + 1
2 + N + 2
3 + N + 3
4 + N + 4
5 + N + 5
N'importe quelle couche
Épaisseur 0,3 mm à 6 mm
Largeur et espace minimum de la ligne 0,05 mm / 0,05 mm (2 mil / 2 mil)
PITCH BGA 0,35 mm
Taille minimum percée au laser 0,075 mm (3 nil)
Taille percée mécanique minimale 0,15 mm (6 mil)
Rapport hauteur / largeur pour trou laser 0,9: 1
Rapport hauteur / largeur pour trou traversant 16: 1
Finition de surface HASL, HASL sans plomb, ENIG, étain d'immersion, OSP, argent d'immersion, doigt d'or, galvanoplastie d'or dur, OSP sélectif , ENEPIG.etc.
Via l'option de remplissage Le via est plaqué et rempli d'époxy conducteur ou non conducteur, puis recouvert et plaqué
Rempli de cuivre, rempli d'argent
Laser via fermeture plaquée cuivre
enregistrement ± 4 mil
Masque de soudure Vert, rouge, jaune, bleu, blanc, noir, violet, noir mat, vert mat, etc.


https://www.ymspcb.com/8-layer-2-step-hdi-board-yms-pcb.html



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  • What is HDI material?

    FR4 Fiberglass board or ceramic board

    Are printed circuit boards still used?

    Yes,the Printed circuit board(PCB) is the foundation of electronic equipment, and it can be found in every electronic device in today ’s world

    What is the major disadvantage of printed circuit boards?

    1.single use 2.environmental pollution 3.high cost

    Is there gold in printed circuit boards?

    yes,there is

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