China HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB factory and manufacturers | Yongmingsheng
हाम्रो वेबसाइट स्वागत छ।

HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

छोटो विवरण:

HDI मुद्रित सर्किट बोर्डहरू offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

मापदण्डहरु

तहहरू: 8

Base Material:FR4 High Tg EM827

मोटाई: 1.6 ± 0.10mm

Min.Hole Size:0.15mm

न्यूनतम रेखा चौडाइ / अन्तरिक्ष: 0.10mm / 0.10mm

भित्री तह PTH र रेखा : ०.२mm को बीचमा न्यूनतम निकासी

आकार: 222mm × 120mm

Aspect Ratio:10.6 : 1

सतह उपचार: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

आवेदन: कम्प्यूटर


उत्पादन विस्तार

सोधिने प्रश्न

उत्पादन टैग

HDI पीसीबी is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI छ बोर्ड उत्पादन प्रक्रिया:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

सारा मा, HDI छ प्लेट को उत्पादन प्रक्रिया जो एक लामो समय को लागि उत्पादन को धेरै पटक पछि पूरा गर्न आवश्यक जटिल छ। यो प्रत्येक तह को शुद्धता र दबाव नियन्त्रणको लागि उच्च आवश्यकताहरु, तर पनि सामाग्री, उपकरण, वातावरण र प्राविधिक कर्मियों मा उच्च स्तर छ।

HDI पीसीबी

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB निर्माण क्षमताहरूको सिंहावलोकन
फिचर क्षमताहरु
तह गणना --60०L
उपलब्ध एचडीआई पीसीबी टेक्नोलोजी १ + एन + १
२ + एन + २
3 + N + 3
+ + N +
+ + N +
कुनै तह
मोटाई 0.3mm-6mm
न्यूनतम रेखा चौड़ाई र स्पेस ०.०5 मीमी / ०.०5 मिमी (२ मिल / २ मिल)
BGA पिच 0.35 मिमी
न्यूनतम लेजर ड्रिल आकार ०.757575 मिमी (n निल)
न्यूनतम मेकानिकल ड्रिल आकार ०.55 मिमि (m मिल)
लेजर होलका लागि पहलू अनुपात ०.9: १
प्वालको अनुपात प्वाल प्वालबाट १:: १
सतह समाप्त एचएएसएल, सीसा नि: शुल्क एचएएसएल, ईएनआईजी, विसर्जन टिन, ओएसपी, विसर्जन रजत, गोल्ड फिंगर, इलेक्ट्रोप्लेटि Hard हार्ड गोल्ड, सेलेक्टिभ OSP , ENEPIG.etc।
विकल्प भर्नुहोस् मार्फत प्लेट गरिएको छ र या त चालक वा गैर-प्रवाहकीय इपोक्सीसँग भरिएको छ र त्यसपछि क्याप गरिएको र प्लेट गरिएको छ
कपर भरियो, चाँदी भरियो
तामा मार्फत लेजर बन्द प्लेट
पञ्जीकरण M 4mil
सोल्डर मास्क हरियो, रातो, पहेंलो, निलो, सेतो, कालो, बैजनी, म्याट कालो, म्याट ग्रीन.इटीसी।

YMS उत्पादनहरु को बारे मा अधिक जान्नुहोस्


https://www.ymspcb.com/8-layer-2-step-hdi-board-yms-pcb.html



  • अघिल्लो:
  • अर्को:

  • What is HDI material?

    FR4 Fiberglass board or ceramic board

    Are printed circuit boards still used?

    Yes,the Printed circuit board(PCB) is the foundation of electronic equipment, and it can be found in every electronic device in today ’s world

    What is the major disadvantage of printed circuit boards?

    1.single use 2.environmental pollution 3.high cost

    Is there gold in printed circuit boards?

    yes,there is

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