HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Goirid Tuairisgeul:

Bùird cuairteachaidh clò-bhuailte HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Chrìochan

Fillidhean: 8

Base Material:FR4 High Tg EM827

Tiughad: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Loidhne as ìsle tron Width / Space: 0.10mm / 0.10mm

Glanadh as ìsle eadar PTH Layer Taobh a-staigh agus Loidhne ： 0.2mm

Size: 222mm x 120mm

Aspect Ratio：10.6 : 1

Surface leigheas: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Iarrtasan: Computer

Cuir post-d thugainn Luchdaich a-nuas mar PDF

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Ceistean Cumanta

bathar Tags

Is e HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Bòrd-obrach riochdachaidh:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Air an t-iomlan, a 'dèanamh pròiseas HDI truinnsear iom-fhillte, a dh'fheumas a bhith air a chrìochnachadh an dèidh iomadh amannan riochdachaidh airson ùine fhada. Chan e a-mhàin àrd riatanasan airson neo-mhearachdachd is shrinkage smachd gach filleadh, ach cuideachd ìrean àrda ann an stuthan, uidheam, àrainneachd agus luchd-obrach teicnigeach.

YMS HDI PCB manufacturing capabilities:

Sealladh farsaing air comasan saothrachaidh YMS HDI PCB
Feart	comasan
Cunntas sreathan	4-60L
Teicneòlas HDI PCB ri fhaighinn	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Còmhdach sam bith
Tiugh	0.3mm-6mm
Leud is àite as ìsle	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Meud drile leusair	0.075mm (3nil)
Meud drile meacanaigeach	0.15mm (6mil)
Co-mheas Gnìomh airson toll laser	0.9: 1
Co-mheas Aspect airson tro tholl	16: 1
Crìoch uachdar	HASL, HASL luaidhe an-asgaidh, ENIG, Tun bogaidh, OSP, Airgead bogaidh, meur òir, òr cruaidh dealanach, OSP roghnach ， ENEPIG.etc.
Tro Roghainn Lìon	Tha an via air a phlàstadh agus air a lìonadh le epoxy seoltach no neo-ghiùlain agus an uairsin air a ribeadh agus air a chur thairis
	Copar air a lìonadh, airgead air a lìonadh
	Laser tro chopar plated dùinte
Clàradh	± 4mil
Measg solder	Uaine, dearg, buidhe, gorm, geal, dubh, purpaidh, dubh dubh, uaine matte.etc.