HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Nkọwa nkenke:

bọọdụ sekit e biri ebi HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

kwa

N'ígwé: 8

Base Material:FR4 High Tg EM827

Ọkpụrụkpụ: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Kacha nta Line Obosara / Space: 0.10mm / 0.10mm

Nwepu kacha nta n'etiti Layer Ne PTH na Line ： 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

N'elu omume: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Ngwa: Computer

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Product Ihe

Ajụjụ

Ngwaahịa

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board mmepụta usoro:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

On dum, mmepụta usoro nke HDI efere bụ mgbagwoju, nke kwesịrị ka a agwụ agwụ mgbe ọtụtụ ugboro nke mmepụta ruo ogologo oge. Ọ bụghị naanị na elu chọrọ maka ziri ezi na shrinkage akara nke ọ bụla oyi akwa, ma ụkpụrụ ndị dị elu ihe, ngwá, gburugburu ebe obibi na oru pesonel.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB n'ichepụta ike nnyocha
Njirimara	ikike
Layer agụ	4-60L
Nwere HDI PCB Technology	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Ọ bụla oyi akwa
Ọkpụrụkpụ	0.3mm-6mm
Opekempe akara Obosara na Ohere	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min laser gbapuru Size	0.075mm (3nil)
Min n'ibu gbapuru Size	0.15mm (6mil)
Akụkụ ruru maka laser onu	0.9: 1
Akụkụ Ratio maka site na oghere	16: 1
Elu rụchaa	HASL, Duru free HASL, ENIG, Imikpu Tin, OSP, ọlaọcha imikpu, mkpịsị aka mkpịsị aka, Ntinye ọla edo siri ike, ịhọrọ OSP ， ENEPIG.etc.
Via Dejupụta Nhọrọ	The via na-plated ma jupụta ma conductive ma ọ bụ ndị na-abụghị conductive epoxy ahụ capped na plated
	Ọla kọpa jupụtara, ọlaọcha jupụtara
	Laser site na ọla kọpa plated mechie
Ndebanye aha	± 4mil
Nkpuchi Solder	Green, Red, Yellow, Blue, White, Nwa, Purple, Matte Black, Matte green. Wdg.