HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Nkọwa nkenke:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

PC HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Product Ihe

Ajụjụ

Ngwaahịa

kwa

N'ígwé: 12

Base Material:FR4 High Tg EM827

Ọkpụrụkpụ ： 1.2 ± 0.1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Nwepu kacha nta n'etiti Layer Ne PTH na Line ： 0.2mm

Size：101mm×55mm

Akụkụ ruru: 8: 1

N'elu omume: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Ngwa: Telecommunication

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-nzọụkwụ HDI enyere njikọ dị n'etiti ọ bụla n'ígwé;

2.Cross-oyi akwa laser nhazi ike welie àgwà larịị nke multi-nzọụkwụ HDI;

3.The Nchikota HDI na elu ugboro ihe, metal dabeere laminates, FPC na ndị ọzọ pụrụ iche laminates na Filiks nwee mkpa nke elu njupụta na elu ugboro, elu okpomọkụ na-eduzi, ma ọ bụ 3D mgbakọ.

YMS HDI PCB n'ichepụta capa ọrụ:

YMS HDI PCB n'ichepụta ike nnyocha
Njirimara	ikike
Layer agụ	4-60L
Nwere HDI PCB Technology	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Ọ bụla oyi akwa
Ọkpụrụkpụ	0.3mm-6mm
Opekempe akara Obosara na Ohere	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min laser gbapuru Size	0.075mm (3nil)
Min n'ibu gbapuru Size	0.15mm (6mil)
Akụkụ ruru maka laser onu	0.9: 1
Akụkụ Ratio maka site na oghere	16: 1
Elu rụchaa	HASL, Duru free HASL, ENIG, Imikpu Tin, OSP, ọlaọcha imikpu, mkpịsị aka mkpịsị aka, Ntinye ọla edo siri ike, ịhọrọ OSP ， ENEPIG.etc.
Via Dejupụta Nhọrọ	The via na-plated ma jupụta ma conductive ma ọ bụ ndị na-abụghị conductive epoxy ahụ capped na plated
	Ọla kọpa jupụtara, ọlaọcha jupụtara
	Laser site na ọla kọpa plated mechie
Ndebanye aha	± 4mil
Nkpuchi Solder	Green, Red, Yellow, Blue, White, Nwa, Purple, Matte Black, Matte green. Wdg.