HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Stutt lýsing:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

An HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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vara Detail

Algengar spurningar

Vara Tags

færibreytur

Lög: 12

Base Material:FR4 High Tg EM827

Þykkt ： 1,2 ± 0,1 mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Lágmarksúthreinsun milli innra lags PTH og línu ： 0,2 mm

Size：101mm×55mm

Hlutföll: 8: 1

Yfirborðsmeðferð: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Umsóknir: Fjarskipti

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-skref HDI gerir tengingu á milli hvaða lag;

2.Cross-lag leysir vinnslu er hægt að auka gæði láréttur flötur multi-skref HDI;

3. The samsetning af HDI og hár-tíðni efni, málm-undirstaða lagskipt, FPC og öðrum sérstökum lagskipt og ferlum gera þarfir hár þéttleiki og hár tíðni, hár hiti stunda, eða 3D samkoma.

YMS HDI PCB framleiðslugetu :

YMS Yfirlit yfir framleiðslugetu PCB PCB
Lögun	getu
Fjöldi laga	4-60L
Í boði HDI PCB tækni	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Hvaða lag sem er
Þykkt	0,3mm-6mm
Lágmarks línubreidd og bil	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Lágmarks leysirboraður stærð	0,075 mm (3 núll)
Lítil vélræn boruð stærð	0,15 mm (6míl)
Hlutfall fyrir leysigat	0,9: 1
Hlutfall hlutfalls fyrir holu	16: 1
Yfirborðsfrágangur	HASL, blýlaust HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating hard Gold, Selective OSP ， ENEPIG.etc.
Með fyllingarvalkosti	The via er húðaður og fylltur með annaðhvort leiðandi eða óleiðandi epoxý, síðan lokað og húðað yfir
	Kopar fyllt, silfur fyllt
	Leysir með koparhúðuðu lokun
Skráning	± 4míl
Lóðmálmur	Grænn, Rauður, Gulur, Blár, Hvítur, Svartur, Fjólublár, Matte Svartur, Matur grænn osfrv.