HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Danasîna Kurt:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

An HDI PCB PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Detail Product

Pirs û Bersîv

Tags Product

Parametreyên

Layers: 12

Base Material:FR4 High Tg EM827

Qalindî ： 1.2 0.1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Paqijiya Kêmtirîn di navbenda Layer PTH û Rêzeya mm 0.2mm

Size：101mm×55mm

Aspect Ratio: 8: 1

tedawî surface: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applications: Telecommunication

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-gaveke HDI derfetê dide ser pêwendiya di navbera her tebeqeyên;

processing laser 2.Cross-layer dikarin asta yên multi-gaveke HDI zêdekirina;

kombînasyona 3.The ji HDI û materyalên-frequency bilind, laminates-based metal, FPC û din laminates û proseyên taybet çalak pêdiviyên de piraniya bilind û firehiya bilind, Meşandina germa bilind, an jî meclîsa 3D.

YMS :

Pêşniyara hilberîna hilberîna YMS HDI PCB
Taybetî	şiyanên
Count Layer	4-60L
Teknolojiya HDI PCB heye	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Her qatek
Qewîtî	0.3mm-6mm
Firehiya û Qada Rêzeya Kêmtirîn	0,05 mm / 0,05 mm (2 mîl / 2 mîl)
BGA PITCH	0.35mm
Min laser Mezinahiya Hûrkirî	0,075 mm (3 nîl)
Min Size Mezinahiya mekanîk	0.15 mm (6 mil)
Aspect Ratio ji bo qulika lazer	0.9: 1
Rêjeya Aspect ji bo bi rêya hole	16: 1
Qediya rûyê erdê	HASL, HASL, ENIG, Tineya Binevvekirinê, OSP, Zîvê Zeviyê, Tiliya Zêr, Zêrînkirina Zexmî ya Elektropîlasyonê, OSP Bijartî ， ENEPIG.pc.
Bi Vebijarka Tijî	Via pêvekirî ye an bi epoxy-ya kondîtîv an ne-kondîtîf tê dagirtin û paşê tê pêçandin û tê pêçandin
	Copper dagirtî, zîv dagirtî
	Laser bi rêya sifir girtin
Qeydkirinî	4 mîlyon ±
Maska Solder	Kesk, Sor, Zer, Blueîn, Spî, Reş, Purple, Reş Mat, Kesk Mat.ett.