HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Disgrifiad byr:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

Mae gan PCB HDI is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

Anfon e-bost atom Llwytho i lawr fel PDF

Manylion cynnyrch

Cwestiynau Cyffredin

cynnyrch Tags

paramedrau

Haenau: 12

Base Material:FR4 High Tg EM827

Trwch ： 1.2 ± 0.1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Isafswm y Clirio rhwng PTH Haen Fewnol a Llinell ： 0.2mm

Size：101mm×55mm

Agwedd Cymhareb: 8: 1

Trin wynebau: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Ceisiadau: Telathrebu

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the PCB HDI design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

HDI 1.Multi-gam yn galluogi'r cysylltiad rhwng unrhyw haenau;

Gall prosesu laser 2.Cross-haen gwella lefel ansawdd HDI aml-gam;

3. cyfuniad o HDI a deunyddiau uchel-amledd, laminiadau seiliedig metel-, FPC a laminiadau a phrosesau arbennig eraill yn galluogi anghenion dwysedd uchel ac amledd uchel, dargludo gwres uchel, neu cynulliad 3D.

YMS HDI PCB manufacturing capa:

Trosolwg galluoedd gweithgynhyrchu PCB YMS HDI
Nodwedd	galluoedd
Cyfrif Haen	4-60L
Technoleg PCB HDI ar gael	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Unrhyw haen
Trwch	0.3mm-6mm
Lled a Gofod Isafswm y llinell	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Maint Drilio Min laser	0.075mm (3nil)
Maint Drilio Min mecanyddol	0.15mm (6mil)
Cymhareb Agwedd ar gyfer twll laser	0.9: 1
Cymhareb Agwedd ar gyfer twll drwodd	16: 1
Gorffen Arwyneb	HASL, HASL di-blwm, ENIG, Tun Trochi, OSP, Arian Trochi, Bys Aur, Aur Caled Electroplatio, OSP Dewisol ， ENEPIG.etc.
Trwy Opsiwn Llenwi	Mae'r via yn cael ei blatio a'i lenwi â naill ai epocsi dargludol neu an-ddargludol yna wedi'i gapio a'i blatio drosodd
	Copr wedi'i lenwi, wedi'i lenwi ag arian
	Laser trwy gau platiog copr
Cofrestru	± 4mil
Mwgwd solder	Gwyrdd, Coch, Melyn, Glas, Gwyn, Du, Porffor, Du Matte, Matte green.etc.