HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Kratek opis:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

An HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Podrobnosti izdelka

Pogosta vprašanja

Oznake izdelka

parametri

Plasti: 12

Base Material:FR4 High Tg EM827

Debelina: 1,2 ± 0,1 mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Najmanjši razmik med notranjim slojem PTH in črto: 0,2 mm

Size：101mm×55mm

Razmerje: 8: 1

površinska obdelava: EniG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikacije: Telekomunikacije

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi korakih HDI omogoča povezavo med vsemi sloji;

2.Cross-plast lasersko obdelavo lahko izboljša raven kakovosti večstopenjskem HDI;

3.Strateški kombinacija HDI in visokofrekvenčnih snovi, laminatov na osnovi kovin, FPC in drugih posebnih laminatov in postopki omogočajo potrebe visoke gostote in visoke frekvence, visoko toplotno prevodna ali 3D montažo.

Zmogljivosti za proizvodnjo PCB YMS HDI :

Pregled proizvodnih zmogljivosti YMS HDI PCB
Značilnost	zmogljivosti
Število slojev	4-60L
Na voljo tehnologija HDI PCB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Kateri koli sloj
Debelina	0,3 mm-6 mm
Najmanjša širina črte in presledek	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA PITCH	0,35 mm
Min lasersko izvrtana velikost	0,075 mm (3nil)
Min. Mehanska vrtana velikost	0,15 mm (6 mil)
Razmerje stranic za lasersko luknjo	0,9: 1
Razmerje stranic skozi luknjo	16: 1
Površinska obdelava	HASL, brez svinca HASL, ENIG, potopni kositer, OSP, potopno srebro, zlati prst, galvansko trdo zlato, selektivni OSP ， ENEPIG.itd.
Prek možnosti polnjenja	Prehod je prekrit in napolnjen s prevodnim ali neprevodnim epoksidom, nato pa pokrit in prevlečen
	Napolnjen z bakrom, napolnjen s srebrom
	Laser preko bakreno prevlečene zaprto
Registracija	± 4mil
Maska za spajkanje	Zelena, rdeča, rumena, modra, bela, črna, vijolična, mat črna, mat zelena itd.