China HDI PCB 12 Layer 2 Step HDI Board | YMS PCB factory and manufacturers | Yongmingsheng
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HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Incazelo emfushane:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

I- I-HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.


umkhiqizo Imininingwane

Imibuzo Evame Ukubuzwa

umkhiqizo Amathegi

amapharamitha

Izinhla: 12

Base Material:FR4 High Tg EM827

Ubukhulu: 1.2 ± 0.1mm

Min.Hole Size:0.15mm

Minimum Line Width/Space:0.075mm/0.075mm

Ukususwa okuncane phakathi kwe-Inner Layer PTH ne-Line: 0.2mm

Size:101mm×55mm

Ukubukeka kwesilinganiselo 8: 1

ukwelashwa surface: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Izicelo: Telecommunication

What is  HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the I-HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI kwenza uxhumano phakathi yimuphi izingqimba;

2.Cross-ungqimba laser ukucutshungulwa kungaba ngcono izinga izinga multi-step HDI;

3.The inhlanganisela HDI futhi high-imvamisa izinto, laminates metal-based, FPC nezinye laminates akhethekile izinqubo unike amandla izidingo high density futhi imvamisa high, okusezingeni eliphezulu ukushisa Umqhubi, noma inhlangano ye-3D.

I-HDI PCB

I-YMS HDI PCB yokukhiqiza i-capa :

Uhlolojikelele lwamakhono wokukhiqiza we-YMS HDI
Isici amakhono
Isendlalelo 4-60L
Iyatholakala HDI PCB Technology 1 + N + 1
2 + N + 2
3 + N + 3
4 + N + 4
5 + N + 5
Noma yimuphi ungqimba
Ubukhulu 0.3mm-6mm
Ubuncane bomugqa nobubanzi 0.05mm / 0.05mm (2mil / 2mil)
IBGA PITCH 0.35mm
Min laser Usayizi yamba 0.075mm (3nil)
Min mechanical Usayizi yamba 0.15mm (6mil)
Isilinganiselo se-laser hole 0.9: 1
Isilinganiselo se-Aspect for through hole 16: 1
I-Surface Qeda I-HASL, iholele mahhala i-HASL, i-ENIG, ukucwiliswa kweTin, i-OSP, ukucwiliswa kwesiliva, umunwe wegolide, i-Electroplating Hard Gold, i-OSP ekhethiwe, ENEPIG.etc
NgeNketho Yokugcwalisa I-via iyagcotshwa futhi igcwaliswe nge-epoxy eqhubayo noma engeyona eqhuba bese igoqelwa futhi yambozwa ngaphezulu
Ithusi lagcwaliswa, kwagcwaliswa isiliva
I-Laser nge-plated ivaliwe
Ukubhalisa ± 4mil
Isifihla Solder Okuluhlaza okotshani, obomvu, ophuzi, ohlaza okwesibhakabhaka, omhlophe, omnyama, onsomi, uMatte Mnyama, uMatte oluhlaza.

Ungase uthande:

1, The application range and circuit advantage of HDI board are introduced

2, PCB production skills: HDI board CAM production method

3, PCB design of 1 step, 2 step and 3step HDI

4, I-HDI PCB Manufacturing Process

5、Asetshenziswa kuphi ama-HDI PCB

6. Enziwa kanjani ama-PCB e-ceramic

7. Kuyini i-ceramic PCB?

8. Iyini Ijubane eliphezulu PCB

9. What is multilayer PCB

10. Double Sided PCB | Types of PCB





  • Previous:
  • Okulandelayo:

  • What is HDI in PCB?

    HDI Boards – High Density Interconnect

    What are the layers of a PCB?

    Substrate Layer.

    Copper Layer.

    Soldermask layer.

    Silkscreen layer.

    What is HDI stackup?

    HDI is short for high density interconnect, and refers to the use of buried, blind and micro vias as well as any layer HDIs to create compact boards.

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