Ama- PCB e-Ceramic akhiwe nge-ceramic substrate, isendlalelo sokuxhuma, kanye nesendlalelo sesekhethi. Ngokungafani ne-MCPCB, ama- PCB e-ceramic awanayo isendlalelo sokufakelwa , futhi ukukhiqiza ungqimba lwesekethe ku-substrate ye-ceramic kunzima. Akhiwa kanjani ama-PCB e-ceramic? Njengoba izinto zobumba zazisetshenziswa njengama-PCB substrates, kwasungulwa izindlela ezimbalwa zokwenza ungqimba lwesekethe ku-substrate ye-ceramic. Lezi zindlela yi-HTCC, i-DBC, ifilimu ewugqinsi, i-LTCC, ifilimu elincanyana, ne-DPC.

I-HTCC

Izinzuzo: amandla aphezulu esakhiwo; high conductivity ezishisayo; ukuzinza okuhle kwamakhemikhali; ukuphakama kwezintambo eziphezulu; I-RoHS iqinisekisiwe

I-Cons: ukungahambi kahle kwesifunda; amazinga okushisa aphezulu e-sintering; izindleko ezibizayo

I-HTCC iyisifinyezo se-ceramic yokushisa okuhambisanayo ne-high-temperature. Kuyindlela yokuqala yokukhiqiza ye-ceramic PCB. Izinto zobumba ze-HTCC ziyi-alumina, i-mullite, noma i-aluminium nitride.

Inqubo yokukhiqiza yayo ithi:

Ku-1300-1600 ℃, impushana ye-ceramic (ngaphandle kwengilazi engeziwe) iyashiswa futhi yomiswe ukuze iqine. Uma umklamo udinga ngezimbobo, izimbobo zimbozwa ebhodini le-substrate.

Emazingeni okushisa afanayo, insimbi encibilika kakhulu iyancibilika njengensimbi. Insimbi ingaba i-tungsten, i-molybdenum, i-molybdenum, i-manganese, njalonjalo. Insimbi ingaba yi-tungsten, i-molybdenum, i-molybdenum, ne-manganese. I-metal paste iphrintiwe ngokusho komklamo ukwenza ungqimba wesifunda ku-substrate yesifunda.

Okulandelayo, i-4% -8% ye-sintering aid iyengezwa.

Uma i-PCB iyi-multilayer, izendlalelo zi-laminated.

Bese kuthi ku-1500-1600 ℃, yonke inhlanganisela ifakwe emanzini ukuze yakhe amabhodi esekethe e-ceramic.

Ekugcineni, imaski ye-solder yengezwe ukuvikela isendlalelo sesifunda.

Ifilimu Encane Ye-Ceramic PCB Manufacturing

Izinzuzo: izinga lokushisa eliphansi lokukhiqiza; isifunda esihle; ubuhle bobuso obuhle

Ububi: imishini yokukhiqiza ebizayo; ayikwazi ukwenza amasekhethi anezinhlangothi ezintathu

Ungqimba lwethusi kufilimu encane ye-ceramic PCBs linogqinsi oluncane kuno-1mm. Izinto zobumba eziyinhloko zama-PCB e-ceramic amafilimu amancane yi-alumina ne-aluminium nitride. Inqubo yokukhiqiza yayo ithi:

I-substrate ye-ceramic ihlanzwa kuqala.

Ezimweni ze-vacuum, umswakama ku-substrate ye-ceramic uyahwamuka ngokushisa.

Okulandelayo, kwakhiwa ungqimba lwethusi phezu kwe-ceramic substrate surface nge-magnetron sputtering.

Isithombe sesifunda sakhiwe phezu kongqimba lwethusi ngobuchwepheshe be-photoresist obuphuzi.

Khona-ke ithusi eliningi lisuswa ngokuqopha.

Ekugcineni, imaski ye-solder yengezwe ukuvikela isifunda.

Isifinyezo: ukukhiqizwa kwefilimu encane ye-ceramic PCB kuqediwe kusimo se-vacuum. Ubuchwepheshe be-lithography yokukhanya okuphuzi buvumela ukunemba okwengeziwe kusekethe. Kodwa-ke, ukukhiqizwa kwefilimu encane kunomkhawulo wokuqina kwethusi. Ama-PCB e-ceramic amafilimu amancane afanele ukupakishwa okunemba okuphezulu kanye namadivayisi ngosayizi omncane.

I-DPC

Izinzuzo: akukho mkhawulo kuhlobo lwe-ceramic nokuqina; isifunda esihle; izinga lokushisa eliphansi lokukhiqiza; ubuhle bobuso obuhle

Ububi: imishini yokukhiqiza ebizayo

I-DPC isifinyezo se-direct plated copper. Ikhula ngendlela yokukhiqiza ifilimu encane ye-ceramic futhi ithuthuke ngokwengeza ukushuba kwethusi ngokusebenzisa i-plating. Inqubo yokukhiqiza yayo ithi:

Inqubo efanayo yokukhiqiza yokukhiqiza ifilimu encane kuze kube yilapho isithombe sesifunda sinyatheliswa efilimu yethusi.

Ugqinsi lwethusi lwesifunda lwengezwe ngokucwenga.

Ifilimu yethusi iyasuswa.

Ekugcineni, imaski ye-solder yengezwe ukuvikela isifunda.

Isiphetho

Lesi sihloko sibala izindlela ezijwayelekile zokukhiqiza ze-ceramic PCB. Yethula izinqubo zokukhiqiza ze-ceramic PCB futhi inikeze ukuhlaziya okufushane kwezindlela. Uma onjiniyela/izinkampani zezixazululo/izikhungo zifuna ukwenziwa futhi kuhlanganiswe ama-PCB e-ceramic, i-YMSPCB izoletha imiphumela eyanelisayo engu-100%.