HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Description:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

An PCB HDI is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

Mitte nobis inscriptio Linguis

Product Detail

FAQ

Product Tags

Morbi

Stratis: XII

Base Material:FR4 High Tg EM827

Crassitudine: 0.1mm ± 1,2

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Iacuit inter interiorem et linea PTH minimum Clearance: 0.2mm

Size：101mm×55mm

Aspect Ratio: VIII: I

Superficiem treatment: enig

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applications: Telecommunication

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the PCB HDI design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi HDI-gradus ope nexum aliquem inter ordines,

2.Cross laser capillus-algarum multi-step processus potest augendae quale planum est HDI:

3. Et concursus istorum HDI summus frequency materiae, secundum metallum, laminates, FPC et alias speciales necessitates de laminates et processus ad enable excelsum densitate et frequency altum, altum calor ductu, vel 3D ecclesiam.

YMS HDI PCB faciens capa capacitatem capam;

YMS HDI PCB vestibulum elit Overview
feature	facultatem
stratum comitis	4-60L
Available HDI PCB Technology	I + I + N
	II + + N II
	III III + + N
	IV + + N IV
	V + + N V
	accumsan nec
crassitudine	0.3mm-6mm
Vivamus ipsum aciem spatium minimum	0.05mm / 0.05mm (2mil / 2mil)
BGA CASTRA	0.35mm
Min Location laser capillus Drilled	0.075mm (3nil)
Min Location mechanica Drilled	0.15mm (6mil)
Aspect laser ratio foraminis	0,9: I
Aspect Ratio enim per foraminis	XVI: I
Conclusio superficiem	Removerit, removerit Category: enig, immersionis Stannum OSP immersionis argenti Digitus Aurum, Aurum Puer electroplating, electionem selectivam OSP ENEPIG.etc.
Via Bene Reple	Et per hoc in patella repleti PROLIXUS vel epoxy erit PROLIXUS vel non-capped et super patella
	Aere impleta implebitur pecunia
	Laser aeris patella per operculi
Registration	± 4mil
Os solidaturam	Viridis, Red, Yellow, cæruleus, albus, Nigrum, Purple, Matte Nigrum, Matte green.etc.