HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Katrangan singkat:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

Lan PCB HDI Kab is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Detail produk

FAQ

Tags Product

paramèter

Lapisan: 12

Base Material:FR4 High Tg EM827

Kekandelan ： 1,2 ± 0,1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Reresik Minimal antarane Inner Layer PTH lan Line ： 0.2mm

Size：101mm×55mm

Aspek: 8: 1

perawatan lumahing: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikasi: Warung

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the PCB HDI Kab design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-langkah IPM mbisakake sambungan antara lapisan;

2.Cross-lapisan Processing laser bisa nambah tingkat kualitas multi-langkah IPM;

kombinasi 3.The saka IPM lan bahan dhuwur-frekuensi, Laminasi basis logam, FPC lan Laminasi khusus lan pangolahan ngaktifake kabutuhan Kapadhetan dhuwur lan frekuensi dhuwur, ngleksanakke dhuwur panas, utawa patemon 3D.

YMS HDI PCB manufaktur :

Ringkesan kabisan pabrik YMS HDI PCB
Fitur	kapabilitas
Count Layer	4-60L
Kasedhiya Teknologi PCB HDI	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lapisan apa wae
Kandel	0.3mm-6mm
Jembar lan Spasi baris minimal	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Ukuran Bor Min laser	0.075mm (3nil)
Ukuran Bor Min mekanis	0.15mm (6mil)
Aspek Rasio kanggo bolongan laser	0,9: 1
Rasio Aspek liwat bolongan	16: 1
Lumahing Rampung	HASL, HASL, timah gratis, ENG, Timah, OSP, Silver Immersion, Driji Emas, Gold Hard Electroplating, OSP Selektif, ENEPIG.etc.
Liwat Isi Isi	Via dilapisi lan diisi epoxy konduktif utawa non-konduktif banjur ditutup lan dilapis
	Isi tembaga, perak isi
	Laser liwat tembaga dilapisi mati
Registrasi	± 4mil
Topeng Solder	Ijo, Abang, Kuning, Biru, Putih, Ireng, Ungu, Matte Ireng, Matte ijo.