| indeks Technical | Kumpulan Massa | kumpulan cilik | Conto | ||
| Bahan Dhasar | FR4 | normal Tg | Shengyi S1141, KB6160, Huazhen H140 (ora cocok kanggo proses free timah) | ||
| Tg tengah | Kanggo IPM, multi lapisan: SY S1000H, ITEQIT158, HuazhengH150; TU-662; | ||||
| Dhuwur Tg | Kanggo tembaga nglukis, lapisan dhuwur: SY S1000-2; ITEQIT180A; HuazhengH170; Langkawi: FR408R; 370HR; TU-752; | ||||
| halogen Free | Tengah Tg: SY S1150G, HuazhengH150HF, H160HF; Tg dhuwur: SY S1165 | ||||
| CTI Dhuwur | CTI≥600 SY S1600, Huazheng H1600HF, H1600A; | ||||
| frekuensi dhuwur | Rogers, Arlon, Taconic, SY SCGA-500, S7136; HuazhengH5000 | ||||
| Kacepetan Dhuwur | SY S7439; TU-862HF, TU-872SLK; Langkawi: I-Speed, aku-Tera @ MT40; Huazheng: H175, H180, H380 | ||||
| Materi Flex | Dhasar | Glue-free: Dupont AK XingyangW-jinis, Panosonic RF-775; | |||
| Coverlay | SY SF305C, Xingyang Q-jinis | ||||
| PP khusus | Ora aliran PP: VT-447LF, Taiguang 370BL Arlon 49N | ||||
| Keramik kapenuhan sheet adhesive: Rogers4450F | |||||
| PTFE adesif sheet: Arlon6700, Taconic FR-27 / FR-28 | |||||
| Pindho sisi coatingPI: xingyang N-1010TF-mb | |||||
| Basis Logam | Berguist Al-basa, Huazheng Al-basa, chaosun Al-basa, copperbase | ||||
| khusus | dhuwur panas resistance rigidity Pi: Tenghui VT-901, Arlon 85N, SY S260 (Tg250) | ||||
| High materi termal doyo: 92ML | |||||
| Keramik materi Pure: Keramik alumina, Aluminium nitride keramik | |||||
| materi BT: Taiwan Nanya NGP-200WT | |||||
| lapisan | FR4 | 36 | 60 | 140 | |
| Kaku & lentur / (Flex) | 16 （6） | 16 （6） | 24 （6） | ||
| High Frequency Campuran laminasi | 12 | 12 | 20 | ||
| PTFE 100% | 6 | 6 | 10 | ||
| IPM | 2 langkah | 3 langkah | 4 langkah | ||
| Index Technical | Kumpulan Massa | Kumpulan cilik | Conto | ||
| Size delivery | Max (mm) | 460 * 560 | 460 * 560 | 550 * 900 | |
| (Mm) | Min (mm) | 20 * 20 | 10 * 10 | 5 * 10 | |
| Jembar / Gap | Inner (mil) | 0.5OZ basa tembaga: 3/3 1.0OZ basa tembaga: 4/4 2.0OZ basa tembaga: 5/6 | |||
| 3.0OZ basa tembaga: 7/9 4.0OZ basa tembaga: 8/12 5.0OZ basa tembaga: 10/15 | |||||
| 6.0OZ basa tembaga: 12/18 10 OZ basa tembaga: 18/24 12 OZ basa tembaga: 20/28 | |||||
| Outer (mil) | 1 / 3OZ basa tembaga: 3/3 0.5OZ basa tembaga: 4/4 1.0OZ basa tembaga: 5/5 | ||||
| 2.0OZ basa tembaga: 6/8 3.0OZ basa tembaga: 7/10 4.0OZ basa tembaga: 8/13 | |||||
| 5.0OZ basa tembaga: 10/16 6.0OZ basa tembaga: 12/18 10 OZ basa tembaga: 18/24 | |||||
| 12 OZ basa tembaga: 20/28 15 OZ basa tembaga: 24/32 | |||||
| Line Jembar Toleransi | > 5,0 mil | ± 20% | ± 20% | 1.0mil ± | |
| ≤5,0 mil | 1.0mil ± | 1.0mil ± | 1.0mil ± | ||
| Ngebur | Min laser (mm) | 0,1 | 0,1 | 0,1 | |
| Min CNC (mm) | 0,2 | 0,15 | 0,15 | ||
| pengeboran dicokot Max CNC (mm) | 6.5 | 6.5 | 6.5 | ||
| Min Setengah Lubuk (mm) | 0,5 | 0,4 | 0,4 | ||
| PTH Lubuk (mm) | normal | ± 0,1 | ± 0,075 | ± 0,075 | |
| Lubuk mencet | ± 0,05 | ± 0,05 | ± 0,05 | ||
| Lubuk Angle (conical) | Lebar diameter≤6.5mm ndhuwur: 800,900,1000,1100; Lebar diameter≥6.5mm ndhuwur: 900; | ||||
| Precision saka ambane-kontrol Drilling (mm) | ± 0,10 | ± 0,075 | ± 0,05 | ||
| Jumlah CNC bolongan wuta siji sisih | ≤2 | ≤3 | ≤4 | ||
| Minimal liwat let bolongan (jaringan beda, militer, medical, automobile) mm | 0,5 | 0,45 | 0,4 | ||
| Minimal liwat let bolongan (jaringan beda, kontrol industri umum lan elektronik konsumen) mm | 0,4 | 0,35 | 0,3 | ||
| indeks Technical | kumpulan Massa | kumpulan cilik | sampel | ||
| Ngebur | Minimal let wall bolongan saka liwat bolongan (karo jaringan sing padha mm) | 0,2 | 0,2 | 0,15 | |
| wall bolongan minimal let (mm) bolongan piranti | 0,8 | 0,7 | 0,7 | ||
| Minimal kadohan saka liwat bolongan menyang tembaga utama utawa baris | 0,2 | 0,18 | ≤10L: 0,15 | ||
| > 10L: 0,18 | |||||
| The min kadohan saka bolongan Piranti tembaga utama utawa baris | 0,3 | 0,27 | 0,25 | ||
| Cincin Las | via bolongan | 4 (IPM 3mil) | 3,5 (IPM 3mil) | 3 | |
| (Mil) | bolongan Component | 8 | 6 | 6 | |
| Bendungan Solder (mil) | (Solder mask) | 5 | 4 | 4 | |
| (Sato) | 6 | 5 | 5 | ||
| Final Board kekandelan | > 1.0 mm | ± 10% | ± 8% | ± 8% | |
| ≤1,0 mm | ± 0.1mm | ± 0.1mm | ± 0.1mm | ||
| kekandelan Board (mm) | 0,5-5,0 | 0.4-6.5 | 0.3-11.5 | ||
| kekandelan Board / pengeboran dicokot | 10:01:00 | 12:01:00 | 13:01:00 | ||
| Via bolongan (pengeboran dicokot) plug bolongan (plug solder) | 0.25-0.5mm | 0.20-0.5mm | 0.15-0.6mm | ||
| bolongan disarèkaké Wuta, bolongan nang pad | 0.25-0.5mm | 0.20-0.5mm | 0.10-0.6mm | ||
| Gendhéwa lan corak | ≤0,75% | ≤0,75% | 0,5% | ||
| impedansi Control | ≥5.0mil | ± 10% | ± 10% | ± 8% | |
| <5.0mil | ± 10% | ± 10% | ± 10% | ||
| CNC | toleransi bleger (mm) | ± 0,15 | ± 0,10 | ± 0,10 | |
| V-CUT Toleransi kekandelan ampas (mm) | ± 0,15 | ± 0,10 | ± 0,10 | ||
| slot nuntun (mm) | ± 0,15 | ± 0,10 | ± 0,10 | ||
| Precision saka kontrol panggilingan jero (mm) | ± 0,15 | ± 0,10 | ± 0,10 | ||
| indeks Technical | kumpulan Massa | kumpulan cilik | sampel | ||
| bleger | pinggiran bevel | 20 ~ 60 derajat; ± 5degree | |||
| Perawatan lumahing | kecemplung emas | kekandelan Ni (mikro inch) | 118-236 | 118-236 | 118-236 |
| Max emas (uinch) | 3 | 3 | 6 | ||
| Hard emas (Au nglukis) | driji Gold (uinch) | 15 | 30 | 60 | |
| NiPdAu | NI (uinch) | 118-236 | |||
| PA (uinch) | 2-5 | ||||
| Au (uinch) | 1-5 | ||||
| Graph emas elektrik | NI (uinch) | 120-400 | |||
| AU (uinch) | 1-3 | ||||
| kecemplung timah | Tin (sing) | 0.8-1.2 | |||
| kecemplung Ag | Ag (uinch) | 6-10 | |||
| OSP | nglukis (sing) | 0,2-0,5 | |||
| HAL / HAL LF | BGApad (mm) | ≥0.3 × 0.3 | |||
| kekandelan (mm) | 0.6≤H≤3.0 | ||||
| kekandelan Board vs diameteripun bolongan | Pencet hole≤3: 1 | ||||
| Tin (sing) | 2.0-40.0 | ||||
| Kaku & lentur | kekandelan dielektrik maksimum lentur | Glue free 25um | 75um Glue-free | Bebas lem75um | |
| part jembaré Flex (mm) | ≥10 | ≥5 | ≥5 | ||
| ukuran layang Max (mm) | 200 × 400 | 200 × 500 | 400 × 550 | ||
| kadohan saka liwat bolongan pinggiran saka kaku & lentur (mm) | ≥1.2 | ≥1.0 | ≥0.8 | ||
| (Mm) kadohan saka komponen bolongan kanggo pojok R & F | ≥1.5 | ≥1.2 | ≥1.0 | ||
| indeks Technical | kumpulan Massa | kumpulan cilik | sampel | ||
| Kaku & lentur | struktur | Struktur njaba lapisan saka sisih lentur, struktur pitulungan Pi lan struktur misahake | Aluminium adhedhasar lentur kaku, kaku lentur IPM, kombinasi, elektromagnetik shielding film | ||
| Tech khusus | Back ngebur PCB, sandwich logam, nglukis tembaga disarèkaké bolongan wuta, slot langkah, bolongan disc, setengah bolongan, mixed laminasi | Dipunsarekaken inti PCB Magnetik | Dipunsarekaken kapasitor / resistor, ditempelake tembaga ing wilayah sebagean, 100% PCB Keramik, disarèkaké riveting nut PCB, komponen ditempelake PCB | ||
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