HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Danasîna Kurt:

Desteyên çerxa çapkirî yên HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parametreyên

Layers: 8

Base Material:FR4 High Tg EM827

Storis: ± 1.6 0.10mm

Min.Hole Size：0.15mm

Siparîşa hindiktirîn Line Firehiya / Space: 0.10mm / 0.10mm

Paqijiya Kêmtirîn di navbenda Layer PTH û Rêzeya mm 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

tedawî surface: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applications: Computer

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Detail Product

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HDI PCB PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

pêvajoya hilberîna HDI Board:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Li ser tevahiya de, pêvajoya hilberînê ya plakaya HDI aloz e, ku divê piştî gelek caran yên hilberînê ji bo demeke dirêj ji bo bi dawî bê. Ev ne bi tenê ye daxwazên bilind ji bo rastbûna û biçûkbûna kontrola her layer, di heman demê de bi standardên bilind li materyalên, alavên, jîngeh û personelên teknîkî.

YMS HDI PCB manufacturing capabilities:

Pêşniyara hilberîna hilberîna YMS HDI PCB
Taybetî	şiyanên
Count Layer	4-60L
Teknolojiya HDI PCB heye	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Her qatek
Qewîtî	0.3mm-6mm
Firehiya û Qada Rêzeya Kêmtirîn	0,05 mm / 0,05 mm (2 mîl / 2 mîl)
BGA PITCH	0.35mm
Min laser Mezinahiya Hûrkirî	0,075 mm (3 nîl)
Min Size Mezinahiya mekanîk	0.15 mm (6 mil)
Aspect Ratio ji bo qulika lazer	0.9: 1
Rêjeya Aspect ji bo bi rêya hole	16: 1
Qediya rûyê erdê	HASL, HASL, ENIG, Tineya Binevvekirinê, OSP, Zîvê Zeviyê, Tiliya Zêr, Zêrînkirina Zexmî ya Elektropîlasyonê, OSP Bijartî ， ENEPIG.pc.
Bi Vebijarka Tijî	Via pêvekirî ye an bi epoxy-ya kondîtîv an ne-kondîtîf tê dagirtin û paşê tê pêçandin û tê pêçandin
	Copper dagirtî, zîv dagirtî
	Laser bi rêya sifir girtin
Qeydkirinî	4 mîlyon ±
Maska Solder	Kesk, Sor, Zer, Blueîn, Spî, Reş, Purple, Reş Mat, Kesk Mat.ett.