HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Breve descripción:

Placas de circuito impreso HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parámetros

Capas: 8

Base Material:FR4 High Tg EM827

Espesor: 1,6 ± 0,10 mm

Min.Hole Size：0.15mm

Mínimo de ancho de línea / espacio: 0,10 mm / 0,10 mm

Espacio mínimo entre la capa interior PTH y la línea: 0,2 mm

Tamaño: 222mm x 120mm

Aspect Ratio：10.6 : 1

Tratamiento de la superficie: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplicaciones: Informática

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PCB HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

Junta IDH proceso de producción:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

En general, el proceso de producción de la placa IDH es compleja, que debe ser completado después de muchos momentos de la producción durante mucho tiempo. Es no sólo los altos requisitos para la precisión y la contracción de control de cada capa, sino también un alto nivel de materiales, equipos, el medio ambiente y el personal técnico.

YMS HDI PCB manufacturing capabilities:

Descripción general de las capacidades de fabricación de PCB YMS HDI
Característica	capacidades
Recuento de capas	4-60L
Tecnología HDI PCB disponible	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Cualquier capa
Grosor	0,3 mm a 6 mm
Ancho y espacio mínimo de línea	0,05 mm / 0,05 mm (2 mil / 2 mil)
TONO BGA	0,35 mm
Tamaño mínimo perforado con láser	0,075 mm (3 nil)
Tamaño mínimo perforado mecánico	0,15 mm (6 mil)
Relación de aspecto para orificio láser	0,9: 1
Relación de aspecto para orificio pasante	16: 1
Acabado de superficie	HASL, HASL sin plomo, ENIG, Estaño de inmersión, OSP, Plata de inmersión, Gold Finger, Galvanoplastia de oro duro, OSP selectivo, ENEPIG.etc.
A través de la opción de relleno	La vía se recubre y se llena con epoxi conductor o no conductor, luego se tapa y se recubre
	Relleno de cobre, relleno de plata
	Láser mediante cierre de cobre
Registro	± 4 mil
Máscara para soldar	Verde, rojo, amarillo, azul, blanco, negro, morado, negro mate, verde mate, etc.